OR2C26A4PS208-DB

FPGA, 576 CLBS, 27600 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 171 36864 2304 208-BFQFP Exposed Pad

Quantity 1,401 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-SQFP2 (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFP Exposed PadNumber of I/O171Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells2304
Number of Gates63600ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of OR2C26A4PS208-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 171 I/O, 2304 logic elements

The OR2C26A4PS208-DB is an ORCA™2 FPGA from Lattice Semiconductor Corporation that delivers moderate-density programmable logic in a compact surface-mount package. It provides 2,304 logic elements, approximately 36.9 kbits of embedded RAM, 171 user I/O pins and an equivalent of 63,600 gates for flexible board-level logic integration.

Designed for commercial-grade applications, this device operates from a 4.75 V to 5.25 V supply and across an operating temperature range of 0 °C to 70 °C. The 208-BFQFP exposed pad package supports PCB integration while the device is RoHS compliant for modern manufacturing requirements.

Key Features

  • Core & Logic  Provides 2,304 logic elements to implement moderate-density programmable logic and custom digital functions.
  • Embedded Memory  Approximately 36,864 bits of on-chip RAM for small data buffers, lookup tables, and state storage.
  • I/O Capability  171 user I/O pins for versatile interfacing with peripherals, sensors, and external devices on a single device.
  • Gate Equivalent  Approximately 63,600 gates for overall design capacity planning and system partitioning.
  • Power and Temperature  Standard 4.75 V to 5.25 V supply range and a commercial operating temperature range of 0 °C to 70 °C.
  • Package & Mounting  208-BFQFP exposed pad (supplier package: 208-SQFP2, 28×28) in a surface-mount form factor to simplify PCB layout and thermal path design.
  • Environmental Compliance  RoHS compliant to meet lead-free assembly and regulatory requirements.

Typical Applications

  • Board-level glue logic  Use the OR2C26A4PS208-DB to consolidate discrete logic functions and simplify PCB designs with its 2,304 logic elements and high I/O count.
  • I/O expansion and interface bridging  171 I/O pins support creating custom interface logic between peripherals and host processors at the board level.
  • Prototyping and development platforms  Moderate logic capacity and on-chip RAM make this FPGA suitable for low- to mid-complexity prototypes and evaluation boards.

Unique Advantages

  • Moderate-density programmable logic: 2,304 logic elements provide a balance between capacity and cost for many commercial designs.
  • High I/O count: 171 user I/O pins enable flexible interfacing without requiring additional devices for many board-level applications.
  • Compact surface-mount package: The 208-BFQFP exposed pad package supports efficient PCB layout and thermal management in space-constrained designs.
  • Standard 5 V supply compatibility: Operates from 4.75 V to 5.25 V to suit systems that use a 5 V power domain.
  • RoHS compliant: Meets lead-free manufacturing requirements for contemporary production environments.

Why Choose OR2C26A4PS208-DB?

The OR2C26A4PS208-DB positions itself as a practical choice for engineers needing moderate-density programmable logic with substantial I/O in a commercial-grade FPGA. Its combination of 2,304 logic elements, roughly 36.9 kbits of embedded RAM, and 171 I/O pins makes it well suited to consolidating logic, implementing custom interfaces, and supporting prototyping activities on 5 V systems.

Built in a 208-BFQFP exposed pad surface-mount package and compliant with RoHS, this device offers a straightforward integration path for board-level designs that prioritize I/O flexibility and configurable logic capacity while operating in standard commercial temperature ranges.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the OR2C26A4PS208-DB.

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