OR2C26A4PS208-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 171 36864 2304 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,401 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP2 (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 171 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 63600 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of OR2C26A4PS208-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 171 I/O, 2304 logic elements
The OR2C26A4PS208-DB is an ORCA™2 FPGA from Lattice Semiconductor Corporation that delivers moderate-density programmable logic in a compact surface-mount package. It provides 2,304 logic elements, approximately 36.9 kbits of embedded RAM, 171 user I/O pins and an equivalent of 63,600 gates for flexible board-level logic integration.
Designed for commercial-grade applications, this device operates from a 4.75 V to 5.25 V supply and across an operating temperature range of 0 °C to 70 °C. The 208-BFQFP exposed pad package supports PCB integration while the device is RoHS compliant for modern manufacturing requirements.
Key Features
- Core & Logic Provides 2,304 logic elements to implement moderate-density programmable logic and custom digital functions.
- Embedded Memory Approximately 36,864 bits of on-chip RAM for small data buffers, lookup tables, and state storage.
- I/O Capability 171 user I/O pins for versatile interfacing with peripherals, sensors, and external devices on a single device.
- Gate Equivalent Approximately 63,600 gates for overall design capacity planning and system partitioning.
- Power and Temperature Standard 4.75 V to 5.25 V supply range and a commercial operating temperature range of 0 °C to 70 °C.
- Package & Mounting 208-BFQFP exposed pad (supplier package: 208-SQFP2, 28×28) in a surface-mount form factor to simplify PCB layout and thermal path design.
- Environmental Compliance RoHS compliant to meet lead-free assembly and regulatory requirements.
Typical Applications
- Board-level glue logic Use the OR2C26A4PS208-DB to consolidate discrete logic functions and simplify PCB designs with its 2,304 logic elements and high I/O count.
- I/O expansion and interface bridging 171 I/O pins support creating custom interface logic between peripherals and host processors at the board level.
- Prototyping and development platforms Moderate logic capacity and on-chip RAM make this FPGA suitable for low- to mid-complexity prototypes and evaluation boards.
Unique Advantages
- Moderate-density programmable logic: 2,304 logic elements provide a balance between capacity and cost for many commercial designs.
- High I/O count: 171 user I/O pins enable flexible interfacing without requiring additional devices for many board-level applications.
- Compact surface-mount package: The 208-BFQFP exposed pad package supports efficient PCB layout and thermal management in space-constrained designs.
- Standard 5 V supply compatibility: Operates from 4.75 V to 5.25 V to suit systems that use a 5 V power domain.
- RoHS compliant: Meets lead-free manufacturing requirements for contemporary production environments.
Why Choose OR2C26A4PS208-DB?
The OR2C26A4PS208-DB positions itself as a practical choice for engineers needing moderate-density programmable logic with substantial I/O in a commercial-grade FPGA. Its combination of 2,304 logic elements, roughly 36.9 kbits of embedded RAM, and 171 I/O pins makes it well suited to consolidating logic, implementing custom interfaces, and supporting prototyping activities on 5 V systems.
Built in a 208-BFQFP exposed pad surface-mount package and compliant with RoHS, this device offers a straightforward integration path for board-level designs that prioritize I/O flexibility and configurable logic capacity while operating in standard commercial temperature ranges.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the OR2C26A4PS208-DB.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016