OR2C26A3BA352I-DB

The OR2C26A3BA352I-DB is an ORCA™2 Field Programmable Gate Array from Lattice Semiconductor Corporation. This industrial‑grade, surface‑mount FPGA provides 2,304 logic elements, approximately 0.037 Mbits of embedded memory, and a high I/O count of 298 in a 352‑ball BGA package.

With a supply range of 4.5–5.5 V and an operating temperature of −40°C to 85°C, the device targets embedded and industrial designs that require moderate logic capacity, substantial I/O density, and a robust thermal/power envelope.

Key Features

• Logic Capacity  2,304 logic elements and 63,600 equivalent gates provide the FPGA fabric for implementing custom logic and control functions.
• Embedded Memory  Total on‑chip RAM of 36,864 bits (approximately 0.037 Mbits) for small data buffers, state machines, and LUT‑based storage.
• I/O Density  298 general‑purpose I/O pins to support extensive peripheral interfacing and board‑level connectivity.
• Package and Mounting  Surface‑mount 352‑BBGA package; supplier device package listed as 352‑PBGA (35×35), enabling compact, high‑pin‑count board layouts.
• Power and Voltage  Operates from a 4.5–5.5 V supply range for compatibility with standard system rails.
• Industrial Temperature Grade  Specified operating range of −40°C to 85°C suitable for industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement control logic, custom interfaces, and I/O aggregation in industrial automation systems using the industrial temperature rating and broad I/O count.
• Embedded Systems  Deploy mid‑density programmable logic for protocol handling, glue logic, and custom accelerators where moderate logic and small on‑chip RAM suffice.
• Communication Interfaces  Leverage the high number of I/Os to support multiple parallel or serial interfaces and board‑level connectivity tasks.

Unique Advantages

• High I/O Capacity:  298 I/Os reduce the need for external multiplexing and simplify board routing for I/O‑intensive designs.
• Mid‑Density Logic:  2,304 logic elements and 63,600 gates provide a balance between capability and footprint for cost‑sensitive designs.
• Industrial Reliability:  Rated for −40°C to 85°C operation, addressing temperature requirements common in industrial deployments.
• Compact BGA Packaging:  352‑ball BGA (supplier package 352‑PBGA, 35×35) enables a high pin count in a compact board area.
• Simple Power Requirements:  Single supply range of 4.5–5.5 V simplifies power rail design in many systems.
• RoHS Compliance:  Meets RoHS requirements for environmentally conscious manufacturing and procurement.

Why Choose OR2C26A3BA352I-DB?

The OR2C26A3BA352I-DB positions itself as an industrial‑grade, mid‑density FPGA that combines a practical logic element count, compact BGA packaging, and a very high I/O count. It is well suited for developers and OEMs building embedded and industrial systems that require reliable operation across a wide temperature range and significant board‑level connectivity.

Backed by Lattice Semiconductor Corporation, this device offers a focused set of capabilities—logic, I/O, and on‑chip RAM—delivered in a surface‑mount 352‑ball package, making it a straightforward option for designs prioritizing integration, I/O density, and industrial temperature performance.

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