XC3030-100PQ100C

IC FPGA 80 I/O 100QFP
Part Description

XC3000 Field Programmable Gate Array (FPGA) IC 80 22176 100-BQFP

Quantity 821 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-PQFP (20x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-BQFPNumber of I/O80Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs100Number of Logic Elements/Cells100
Number of Gates2000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits22176

Overview of XC3030-100PQ100C – XC3000 Field Programmable Gate Array (FPGA) IC, 100 logic elements, 80 I/Os, 22,176-bit RAM, 100-BQFP

The XC3030-100PQ100C is a member of the XC3000 logic cell array family of field programmable gate arrays (FPGAs). It provides a compact, reprogrammable logic solution based on the XC3000 architecture for general logic replacement and sub-systems integration.

Designed for commercial applications, this device combines approximately 100 logic elements with roughly 22,176 bits of on-chip RAM, 80 user I/Os and a nominal supply range of 4.75 V to 5.25 V to address a broad set of low- to mid-density FPGA requirements.

Key Features

  • Core Logic Approximately 100 logic elements (CLBs) arranged as a 10 × 10 CLB array, delivering around 2,000 gates of device capacity suitable for glue logic and small subsystem integration.
  • Embedded Memory Approximately 22,176 bits of on-chip RAM to support buffering, small lookup tables and local data storage within the device.
  • I/O Capability 80 user-definable I/Os to interface with external peripherals and system signals while consolidating discrete logic functions.
  • Performance Family-spec performance includes guaranteed toggle rates in the 70–125 MHz range (logic delays ~9 to 5.5 ns), allowing predictable timing for many embedded designs.
  • Power and Power-Down Advanced CMOS static memory technology with low quiescent and active power consumption, plus an ultra-low current option in Power-Down mode for reduced standby draw.
  • Output Drive Output drivers rated for 4 mA source and sink capability to drive common logic loads directly.
  • Package & Mounting Surface-mount 100-BQFP package (supplier package 100-PQFP, 20 × 14) for compact board-level integration.
  • Supply & Temperature Operates from 4.75 V to 5.25 V and specified for commercial-grade operation from 0 °C to 85 °C junction temperature.
  • Compatibility & Migration XC3000 family bitstreams are compatible within the family and support migration paths to mask-programmed XC3300 HardWire devices for high-volume production.
  • Standards RoHS compliant for environmental compliance in commercial applications.

Typical Applications

  • General Logic Replacement Consolidate discrete logic gates and glue logic into a single reprogrammable device to reduce BOM and simplify PCB routing.
  • Sub‑System Integration Integrate small control blocks, state machines and protocol glue within embedded subsystems to streamline board-level design.
  • Design Migration Use as a development or production choice with an established migration path to XC3300 HardWire devices for cost-optimized high-volume runs.

Unique Advantages

  • Compact, usable logic capacity: Approximately 100 CLBs and ~2,000 gates provide enough density for medium-complexity control and interfacing tasks without over‑specifying the device.
  • Substantial embedded RAM: About 22,176 bits of on-chip memory enable local buffering and LUT-based implementations, reducing external memory needs.
  • Rich I/O count: 80 user I/Os allow flexible interfacing to sensors, peripherals and buses, minimizing additional interface components.
  • Predictable timing behavior: Family-rated toggle frequencies (70–125 MHz) and documented logic delays help with early timing planning and verification.
  • Low-power options: CMOS static memory technology with low active/quiescent current and an ultra-low current power-down option supports energy-sensitive designs.
  • Production-friendly package: 100‑pin BQFP surface-mount package offers a compact footprint compatible with standard PCB assembly processes.

Why Choose XC3030-100PQ100C?

The XC3030-100PQ100C positions itself as a practical, commercial-grade FPGA option within the XC3000 family for designers needing reprogrammable logic, embedded RAM and a generous I/O complement in a compact package. Its combination of roughly 100 logic elements, ~22,176 bits of on-chip memory and 80 I/Os makes it well suited for replacing discrete logic, integrating small subsystems and supporting development-to-production migration paths.

With documented operating conditions, predictable timing characteristics and RoHS compliance, this device offers a verifiable, board-level programmable solution for engineering teams focused on reliability, integration and cost-effective system design.

Request a quote or submit a sales inquiry today to discuss availability and pricing for the XC3030-100PQ100C.

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