XC4006E-2PG156C

IC FPGA 125 I/O 156CPGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 125 8192 608 156-BCPGA

Quantity 1,748 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package156-CPGA (42.16x42.16)GradeCommercialOperating Temperature0°C – 85°C
Package / Case156-BCPGANumber of I/O125Voltage4.75 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs256Number of Logic Elements/Cells608
Number of Gates6000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits8192

Overview of XC4006E-2PG156C – XC4000E FPGA, 608 logic elements, 125 I/O, 156-BCPGA

The XC4006E-2PG156C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD in the XC4000E family. It provides programmable logic resources, embedded RAM and a substantial I/O count in a 156-BCPGA through-hole package, targeting general-purpose commercial programmable-logic applications.

Designed for systems that require moderate logic density and flexible interfacing, this device combines 608 logic elements with on-chip memory and a standard 5 V supply range for straightforward integration into existing designs.

Key Features

  • Core logic  608 logic elements organized across 256 LABs for implementing combinational and sequential logic functions.
  • Embedded memory  Approximately 8 Kbits of on-chip RAM (8,192 total RAM bits) to support data buffering, small LUT-based state tables, and local storage.
  • I/O capability  125 I/O pins to enable broad peripheral interfacing and signal routing without extensive external glue logic.
  • Logic density  Estimated 6,000 gates of logic capacity for moderate-complexity designs and glue logic replacement.
  • Power  Standard 5 V supply range (4.75 V to 5.25 V) for compatibility with legacy 5 V systems and boards.
  • Package & mounting  156-BCPGA package (supplier device package: 156-CPGA, 42.16 × 42.16 mm) with through-hole mounting for ease of board-level integration and prototyping.
  • Operating range & grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Environmental compliance  RoHS compliant.

Typical Applications

  • Commercial embedded systems  Use the XC4006E-2PG156C where moderate programmable logic and commercial-grade operation are required.
  • I/O-intensive control and interfacing  High I/O count supports a variety of peripheral interfaces and board-level signal management tasks.
  • Through-hole or legacy PCB designs  Through-hole 156-BCPGA package fits boards and assemblies that favor established mounting methods and mechanical robustness.
  • Small to mid-scale programmable logic implementations  608 logic elements and embedded RAM make this device suitable for compact logic, glue logic, and control functions.

Unique Advantages

  • Balanced logic and memory  Combines 608 logic elements with ~8 Kbits of embedded RAM to implement control, state machines, and local buffering without external memory.
  • Substantial I/O integration  125 I/O pins reduce the need for additional interface components and simplify board-level design.
  • Through-hole packaging for ease of integration  156-BCPGA through-hole package supports legacy boards and simplifies prototyping and repair.
  • Standard 5 V compatibility  Operates from 4.75 V to 5.25 V, easing integration into existing 5 V supply rails.
  • Commercial temperature and RoHS compliance  Specified 0 °C to 85 °C operating range and RoHS compliance support broad commercial deployment and regulatory needs.

Why Choose XC4006E-2PG156C?

The XC4006E-2PG156C offers a practical combination of logic resources, embedded memory and a high I/O count in a through-hole 156-BCPGA package from AMD. Its commercial-grade specification and standard 5 V supply range make it well suited for designs that require moderate-density programmable logic with straightforward board-level integration.

This device is appropriate for engineers and procurement teams seeking a reliable, RoHS-compliant FPGA option for compact control, interface, or glue-logic roles where 608 logic elements and roughly 8 Kbits of on-chip RAM meet the design requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4006E-2PG156C. Provide your quantity and delivery requirements to receive a tailored response.

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