XC4010E-1BG225C

IC FPGA 160 I/O 225BGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 160 12800 950 225-BBGA

Quantity 310 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package225-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case225-BBGANumber of I/O160Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells950
Number of Gates10000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits12800

Overview of XC4010E-1BG225C – XC4000E/X Field Programmable Gate Array (FPGA), 225‑BBGA

The XC4010E-1BG225C is a Field Programmable Gate Array (FPGA) IC from AMD, provided in a 225‑BBGA surface‑mount package. It offers reconfigurable digital logic with defined on‑chip resources and I/O density for embedded and board‑level designs.

This commercial‑grade device is specified for a 4.75 V to 5.25 V supply and an operating temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

  • Logic Capacity — Contains 950 logic elements (cells) and is characterized with approximately 10,000 gates for implementing custom digital functions.
  • On‑Chip Memory — Provides 12,800 bits of embedded RAM for temporary data storage and buffering within user designs.
  • I/O Resources — Supports 160 user I/O pins to connect peripherals, buses, and external logic on the board.
  • Packaging — Supplied in a 225‑BBGA package; supplier device package listed as 225‑PBGA (27×27) for compact board integration.
  • Power Supply — Operates from a 4.75 V to 5.25 V supply range suitable for 5 V system environments.
  • Mounting & Grade — Surface mount package and commercial temperature grade (0 °C to 85 °C).
  • Compliance — RoHS compliant.

Typical Applications

  • Custom Digital Logic — Implement glue logic, state machines, and application‑specific digital functions using the 950 logic elements and approximately 10,000 gates.
  • Interface Bridging — Use the 160 I/Os to bridge or translate between multiple bus standards and peripheral interfaces on a single board.
  • On‑Board Prototyping — Rapidly prototype and iterate digital designs leveraging reprogrammable logic and the device’s embedded RAM for temporary storage and buffering.

Unique Advantages

  • Balanced Logic and Memory: 950 logic elements combined with 12,800 bits of on‑chip RAM provide a compact mix of computation and storage for mid‑scale designs.
  • Generous I/O Count: 160 user I/Os allow flexible connectivity for peripherals, sensors, and bus interfaces without external IO expanders.
  • Standard 5 V Support: Direct compatibility with 4.75 V to 5.25 V systems simplifies power supply design in 5 V environments.
  • Compact BGA Footprint: 225‑ball PBGA/BGA package (27×27) enables dense board layouts while maintaining surface‑mount assembly compatibility.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial applications and environments.
  • RoHS Compliant: Meets RoHS requirements for materials compliance in many regions and manufacturing chains.

Why Choose XC4010E-1BG225C?

The XC4010E-1BG225C positions itself as a practical, mid‑capacity FPGA option for designers needing a balance of logic elements, embedded RAM, and a high I/O count in a compact BGA package. Its 5 V supply compatibility and commercial operating range make it suitable for a range of board‑level digital implementations.

This device is a fit for engineering teams and procurement looking for a reprogrammable, RoHS‑compliant FPGA that integrates moderate logic capacity and on‑chip memory with substantial I/O connectivity for prototyping, interface functions, and custom digital logic.

Request a quote or submit an inquiry to get pricing and availability for the XC4010E-1BG225C.

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