XC4010XL-3PQ208C

The XC4010XL-3PQ208C is a Field Programmable Gate Array (FPGA) IC from AMD designed for commercial-grade applications. It integrates approximately 950 logic elements, ~12,800 bits of on-chip RAM and up to 160 programmable I/O in a 208-BFQFP package.

This device is suited for designs that require moderate on-chip logic capacity and I/O density while operating from a 3.0 V to 3.6 V supply and within a 0 °C to 85 °C ambient range.

Key Features

• Logic Capacity — Approximately 950 logic elements and roughly 10,000 gates provide configurable combinational and sequential logic resources for glue logic, state machines and custom datapaths.
• Embedded Memory — Approximately 12,800 bits of on-chip RAM to store small tables, FIFOs or buffering for control and data-handling functions.
• I/O Density — Up to 160 general-purpose I/O pins to support parallel interfaces, peripheral control and signal routing.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting suitable for high-pin-count board layouts.
• Power — Single-supply operation from 3.0 V to 3.6 V simplifies power-rail design in systems using standard 3.3 V logic domains.
• Commercial Temperature Range — Rated for operation from 0 °C to 85 °C to meet typical commercial-environment requirements.
• Environmental Compliance — RoHS compliant for adherence to common lead-free manufacturing requirements.

Typical Applications

• Consumer & Commercial Electronics — Implement control logic, interface translation and custom timing functions using the device’s logic elements and I/O count.
• Embedded Control — Use the on-chip RAM and logic resources for configuration of state machines, peripheral controllers and simple data buffering.
• Prototyping & Development — A compact FPGA option for evaluating small- to medium-scale logic designs and proof-of-concept hardware implementations.
• I/O Expansion — Add programmable I/O capability for systems that require additional parallel signals or custom interfacing in a 208-pin package.

Unique Advantages

• Balanced Logic and Memory: Combines approximately 950 logic elements with ~12,800 bits of embedded RAM to support mixed logic and small-data storage needs.
• High I/O Count in a Compact Package: 160 I/O pins in a 208-BFQFP footprint allow dense connectivity without an overly large package.
• Standard 3.3 V Supply Compatibility: Operation from 3.0 V to 3.6 V aligns with common 3.3 V system domains for straightforward power integration.
• Surface-Mount, Lead-Free Friendly: 208-BFQFP surface-mount package and RoHS compliance support modern PCB assembly and environmental requirements.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for general commercial product deployments.

Why Choose XC4010XL-3PQ208C?

The XC4010XL-3PQ208C provides a practical balance of programmable logic capacity, embedded memory and I/O density for commercial applications that need configurable logic without excessive device complexity. Its package and electrical characteristics make it suitable for designs targeting 3.3 V systems with up to 160 external signals.

Manufactured by AMD and RoHS compliant, this FPGA is appropriate for engineers and procurement teams seeking a commercially rated, surface-mount programmable device with defined logic, memory and I/O resources for mid-range embedded and interface designs.

Request a quote or submit an inquiry for XC4010XL-3PQ208C to obtain pricing, availability and delivery information for your next design.