XC4013E-1BG225C

The XC4013E-1BG225C is a Field Programmable Gate Array (FPGA) from the XC4000E/X family designed for programmable digital logic implementation. It provides a balanced combination of configurable logic capacity, on-chip memory, and I/O density for commercial embedded and control designs.

With 1,368 logic elements, 18,432 bits of embedded RAM and 192 I/O pins in a 225-ball BGA package, this device targets moderate-complexity logic functions where board-level integration and flexible I/O are priorities.

Key Features

• Core Logic 1,368 logic elements enable implementation of custom digital functions and finite-state machines with discrete on-chip resources.
• Embedded Memory 18,432 bits of on-chip RAM suitable for small buffers, FIFOs, and state storage within the programmable fabric.
• I/O and Gate Count 192 general-purpose I/O pins and approximately 13,000 gates provide connectivity and gate-equivalent capacity for mixed-signal interfacing and glue logic.
• Package and Mounting 225-ball BGA package (supplier device package: 225-PBGA, 27×27) in a surface-mount form factor to support compact PCB layouts.
• Power and Temperature Single supply operation from 4.75 V to 5.25 V and a commercial operating range of 0 °C to 85 °C for standard application environments.
• Environmental Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Custom Digital Logic Implement glue logic, state machines and protocol translators using the device's 1,368 logic elements and embedded RAM.
• I/O Expansion and Interface Bridging Use the 192 I/O pins for adding parallel interfaces, bus adapters or signal conditioning between subsystems.
• Prototyping and Development Rapidly prototype moderate-complexity digital functions and verify hardware concepts on a compact BGA package.

Unique Advantages

• Balanced Logic Capacity: 1,368 logic elements provide the right scale for mid-range programmable designs without excessive area or power overhead.
• On-Chip Memory: 18,432 bits of embedded RAM enable local buffering and state retention without external memory components.
• High I/O Density: 192 I/O pins deliver flexible connectivity options for interfacing with peripherals and external logic.
• Compact BGA Packaging: 225-ball BGA in a surface-mount format supports high-density PCB designs and reliable solder connections.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match standard commercial application environments.
• RoHS Compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose XC4013E-1BG225C?

The XC4013E-1BG225C positions itself as a practical FPGA choice for engineers requiring moderate logic capacity, embedded RAM, and a high I/O count in a compact surface-mount BGA package. Its specification set—1,368 logic elements, 18,432 bits of RAM, approximately 13,000 gates and 192 I/O—makes it suitable for board-level integration where programmable logic reduces component count and streamlines design.

This commercial-grade device is appropriate for developers and procurement teams focused on scalable, maintainable digital designs that benefit from on-chip memory and flexible I/O while adhering to RoHS manufacturing requirements.

If you would like pricing or availability information for the XC4013E-1BG225C, request a quote or submit an inquiry and our team will respond with a tailored quote and lead-time details.