XC4013XL-2HT176C

The XC4013XL-2HT176C is a Field Programmable Gate Array (FPGA) IC from AMD's XC4000E/X family. Packaged in a 176-LQFP exposed pad surface-mount package, it delivers moderate on-chip logic and memory resources alongside a high I/O count for commercial embedded applications. This device targets designs that require a balance of logic capacity, embedded RAM, and broad connectivity in a compact footprint.

Key Features

• Logic Capacity — 1,368 logic elements and approximately 13,000 gates provide resources for moderate-complexity digital designs; the device specification also lists 576 logic blocks for partitioning logic.
• Embedded Memory — 18,432 bits of on-chip RAM for buffering, small lookup tables, and temporary data storage.
• I/O Density — 145 I/O pins offer extensive external interfacing options for peripherals, sensors, and buses.
• Package & Mounting — 176-LQFP exposed pad package (supplier device package listed as 176-TQFP 24×24) in a surface-mount form factor for PCB space-efficient designs.
• Power — Operates from a 3.0 V to 3.6 V supply, compatible with standard 3.3 V systems.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Embedded Control — Implement state machines and control logic where moderate logic resources and multiple I/O are required.
• Interface Bridging — Act as glue logic or protocol translators between multiple peripherals using the device's high I/O count.
• Prototyping and Development — Suitable for evaluating digital functions and small-scale prototypes that fit within the available logic and RAM resources.

Unique Advantages

• Balanced Logic and Memory: 1,368 logic elements paired with 18,432 bits of on-chip RAM support a variety of moderate-complexity designs without external memory for small buffers.
• High I/O Count: 145 I/O pins enable connection to numerous peripherals and sensors, reducing the need for additional interface chips.
• Compact Surface-Mount Package: The 176-LQFP exposed pad (176-TQFP 24×24) provides a compact, manufacturable footprint for space-constrained PCBs.
• Standard Power Domain: 3.0–3.6 V supply voltage aligns with common 3.3 V system designs for straightforward power integration.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial environments and applications.
• RoHS Compliant: Meets RoHS requirements for lead-free assembly and environmental standards.

Why Choose XC4013XL-2HT176C?

The XC4013XL-2HT176C provides a practical combination of logic resources, embedded RAM, and extensive I/O in a compact 176-LQFP exposed pad package, making it well suited for commercial embedded projects that require moderate logic density and broad connectivity. Its 3.0–3.6 V supply range and RoHS compliance simplify integration into standard 3.3 V system designs and modern manufacturing workflows.

Choose this device when your design priorities include a balanced on-chip resource set, high I/O availability, and a manufacturable surface-mount package for prototyping or volume commercial applications within the specified operating temperature range.

Request a quote or submit a product inquiry today to receive pricing and availability information for the XC4013XL-2HT176C.