XC4013XL-3PQ208I

The XC4013XL-3PQ208I is a field programmable gate array (FPGA) from the XC4000E/X family by AMD. It provides on-chip programmable logic and embedded memory suitable for designs that require configurable digital logic, moderate on-chip RAM, and a substantial number of I/O pins.

With 1,368 logic elements, 18,432 bits of embedded RAM and 160 I/Os in a 208-BFQFP surface-mount package, this industrial-grade device is intended for applications that need reconfigurable logic at supply voltages between 3.0 V and 3.6 V and operation from −40 °C to 100 °C.

Key Features

• Logic Capacity — Provides 1,368 logic elements to implement custom digital functions and finite-state machines.
• On-chip Memory — Includes 18,432 bits of embedded RAM for data buffering, small lookup tables, and state storage.
• I/O Density — 160 general-purpose I/O pins for interfacing with sensors, peripheral ICs and external logic.
• Package & Mounting — Available in a 208-BFQFP package (supplier package: 208-PQFP, 28×28) designed for surface-mount assembly.
• Power — Operates from a 3.0 V to 3.6 V supply range to match common system rails.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C suitable for industrial environments.
• Device Scale — Approximately 13,000 gates providing additional context for achievable logic density.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic, sensor interfacing and I/O aggregation where the industrial temperature range and 160 I/Os are beneficial.
• Embedded Systems — Use the FPGA’s logic elements and embedded RAM for glue logic, protocol handling and timing-critical functions in embedded designs.
• Prototyping and Custom Logic — Rapidly iterate and validate digital architectures that require reprogrammable logic and moderate on-chip memory.
• Interface Bridging — Create custom interfaces and signal adaptation between disparate peripherals using plentiful I/O and programmable logic.

Unique Advantages

• Balanced Logic and Memory — 1,368 logic elements combined with 18,432 bits of RAM supports a wide range of mid-complexity logic implementations without external memory.
• High I/O Count — 160 I/Os reduce the need for external GPIO expanders and simplify board-level routing for multi-signal interfaces.
• Industrial Reliability — Specified for −40 °C to 100 °C operation and supplied in a robust surface-mount BFQFP package for industrial applications.
• Standard Supply Voltage — Compatible with 3.0 V–3.6 V system rails, easing integration into existing power architectures.
• RoHS Compliance — Meets RoHS requirements for environmentally conscious designs and manufacturing.

Why Choose XC4013XL-3PQ208I?

The XC4013XL-3PQ208I offers a practical combination of programmable logic resources, embedded RAM and high I/O density in a single, industrial-grade FPGA package. It is positioned for engineers who need reconfigurable digital logic with predictable power and temperature characteristics for industrial and embedded applications.

This device is suited to designs that demand moderate gate density, ample I/O, and on-chip memory without adding external components, delivering a compact, RoHS-compliant solution from AMD for mid-complexity FPGA implementations.

Request a quote or submit an inquiry to check availability, lead times and pricing for the XC4013XL-3PQ208I. Our team can provide technical details and support for incorporating this FPGA into your design.