XC4020E-1PG223C

IC FPGA 192 I/O 223CPGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 192 25088 1862 223-BCPGA

Quantity 488 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package223-CPGA (47.24x47.24)GradeCommercialOperating Temperature0°C – 85°C
Package / Case223-BCPGANumber of I/O192Voltage4.75 V - 5.25 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs784Number of Logic Elements/Cells1862
Number of Gates20000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits25088

Overview of XC4020E-1PG223C – XC4000E/X Field Programmable Gate Array (FPGA) IC 192 25088 1862 223-BCPGA

The XC4020E-1PG223C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD in the XC4000E/X family. It combines a mid-range logic capacity with embedded RAM and a high count of user I/O pins to support custom digital designs and board-level integration.

With 1,862 logic elements, approximately 25,088 bits of on-chip RAM, and 192 I/O lines in a 223-BCPGA through-hole package, this device is suited for applications that require flexible programmable logic, multiple external interfaces, and a standard 5 V supply range.

Key Features

  • Core Logic  1,862 logic elements providing programmable resources for custom combinational and sequential logic implementations; approximately 20,000 equivalent gates for moderate-density designs.
  • Embedded Memory  25,088 bits of on-chip RAM (approximately 0.025 Mbits) to support small FIFOs, state storage, and local buffering without external memory.
  • I/O Capacity  192 user I/O pins to support multiple parallel interfaces, peripheral connections, and board-level signal routing.
  • Power  Operates from a 4.75 V to 5.25 V supply range compatible with common 5 V digital systems.
  • Package & Mounting  223-BCPGA package with a 47.24 × 47.24 mm footprint and through-hole mounting for robust board attachment and compatibility with legacy designs and prototyping fixtures.
  • Temperature & Grade  Commercial temperature range of 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

  • Digital Logic Prototyping  Implement and validate custom logic functions, glue logic, and state machines during development and early production runs.
  • Embedded Control  Use as a programmable control element for mid-complexity embedded systems requiring on-chip memory and multiple I/O lines.
  • Interface and Signal Aggregation  Consolidate and manage multiple parallel interfaces or peripheral signals using its 192 I/O pins to reduce board-level complexity.
  • Legacy and Through-Hole Designs  Through-hole mounting in a large BCPGA package supports retrofit, evaluation, and systems where socketed or mechanically robust attachment is preferred.

Unique Advantages

  • Balanced Logic Density: 1,862 logic elements with an equivalent of 20,000 gates provide a practical balance between capacity and cost for medium-complexity designs.
  • On-Chip Memory: 25,088 bits of embedded RAM reduce the need for small external memory devices for buffering and state storage.
  • High I/O Count: 192 I/O pins enable extensive peripheral connectivity and parallel interface support without external I/O expanders.
  • 5 V System Compatibility: 4.75 V to 5.25 V operating range aligns with standard 5 V digital systems, easing integration into existing power domains.
  • Through-Hole Package for Robustness: The 223-BCPGA through-hole package and 47.24 × 47.24 mm footprint provide mechanical durability and straightforward prototyping or socketing options.
  • RoHS Compliance: Environmentally compliant manufacturing supports regulatory and procurement requirements for lead-free assembly.

Why Choose XC4020E-1PG223C?

The XC4020E-1PG223C positions itself as a practical, commercial-grade FPGA for engineers needing moderate logic capacity, substantial I/O, and on-chip RAM within a through-hole BCPGA package. Its combination of 1,862 logic elements, 25,088 bits of embedded memory, and 192 I/O pins supports a wide range of mid-complexity digital designs where board-level robustness and 5 V compatibility are important.

This device is well suited for development teams and production designs that prioritize flexible programmable logic, consolidated interfacing, and proven package formats. Its RoHS compliance and commercial temperature rating make it appropriate for standard electronic applications and manufacturing environments.

If you would like pricing information or to request a quote for the XC4020E-1PG223C, please submit a product inquiry or request a quote today.

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