XC5206-3TQ144C

FPGA, 196 CLBS, 6000 GATES
Part Description

XC5200 Field Programmable Gate Array (FPGA) IC 117 784 144-LQFP Exposed Pad

Quantity 1,642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O117Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs196Number of Logic Elements/Cells784
Number of Gates10000ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of XC5206-3TQ144C – XC5200 Field Programmable Gate Array (FPGA), 117 I/O, 784 Logic Elements, 144-LQFP Exposed Pad

The XC5206-3TQ144C is a field programmable gate array (FPGA) IC from AMD, offering a compact, reprogrammable logic fabric suitable for commercial embedded designs. The device integrates 196 CLBs delivering 784 logic elements, alongside up to 117 user I/O pins, enabling flexible implementation of control, interface, and glue-logic functions.

Designed for surface-mount assembly in a 144-LQFP package with exposed pad, the XC5206-3TQ144C operates from a 4.75 V to 5.25 V supply and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant.

Key Features

  • Logic Fabric 196 CLBs providing 784 logic elements for implementing medium-complexity digital designs and custom logic functions.
  • Gate Count Approximately 10,000 gates to quantify overall logic capacity for synthesis and resource planning.
  • I/O Capacity 117 user I/O pins to support multiple peripheral interfaces, signal routing, and board-level connectivity.
  • Memory On-chip embedded memory: 0 total RAM bits (no dedicated embedded RAM reported).
  • Power Operates from a single 4.75 V to 5.25 V supply, compatible with standard 5 V system rails.
  • Package & Mounting 144-LQFP (exposed pad) surface-mount package, supplier device package listed as 144-TQFP (20×20), suitable for compact PCB layouts and thermal grounding via the exposed pad.
  • Operating Conditions Commercial-grade device rated for 0 °C to 85 °C ambient operation.
  • Environmental Compliance RoHS compliant for restricted-substance requirements.

Typical Applications

  • Embedded Control and Glue Logic — Use the XC5206-3TQ144C to consolidate discrete logic and implement custom control functions between microcontrollers and peripherals, leveraging its 117 I/O pins.
  • Interface Bridging — Implement protocol translation and bus interfacing in commercial devices where a 5 V supply and moderate logic resources meet system requirements.
  • Prototyping and Development — Suitable for prototype boards and proof-of-concept designs that require reprogrammable logic with a moderate number of logic elements and I/O.
  • User Interface Control — Manage button scanning, LED drivers, and simple UI logic using the available CLBs and I/O resources.

Unique Advantages

  • Balanced Logic Capacity: 196 CLBs and 784 logic elements provide a clear sizing point for medium-complexity designs without over-provisioning.
  • Generous I/O Count: 117 user I/O pins enable direct connection to multiple peripherals and sensors, reducing need for external I/O expanders.
  • 5 V System Compatibility: Native operation from 4.75 V to 5.25 V simplifies integration into existing 5 V commercial systems.
  • Compact, Heat-Managed Package: 144-LQFP with exposed pad supports surface-mount assembly and provides a means to improve thermal performance on the PCB.
  • Commercial Temperature Rating: Specified for 0 °C to 85 °C operation, aligning with typical commercial product environments.
  • Regulatory Compliance: RoHS compliance supports deployment in environments requiring restricted-substance adherence.

Why Choose XC5206-3TQ144C?

The XC5206-3TQ144C is positioned for designers seeking a commercially rated FPGA with a moderate logic footprint, ample I/O, and straightforward 5 V system integration. Its combination of 196 CLBs (784 logic elements), roughly 10,000 gates, and a 144-LQFP exposed-pad package makes it a pragmatic choice for embedded control, interface bridging, and prototyping tasks where space and board-level thermal management are considerations.

Manufactured by AMD and RoHS compliant, this device suits commercial product development teams and OEMs requiring a reprogrammable logic solution that aligns with standard 5 V architectures and commercial temperature ranges.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5206-3TQ144C. Our team can help with lead times, packaging options, and order placement.

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