XC5210-5PQG208C
| Part Description |
XC5200 Field Programmable Gate Array (FPGA) IC 164 1296 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 713 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 164 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 324 | Number of Logic Elements/Cells | 1296 | ||
| Number of Gates | 16000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of XC5210-5PQG208C – Field Programmable Gate Array (FPGA) IC, 164 I/O, 1296 Logic Elements, 208-BFQFP
The XC5210-5PQG208C is an AMD Field Programmable Gate Array (FPGA) provided in a 208‑lead BFQFP exposed pad package. It delivers a moderate logic capacity with 1,296 logic elements and 324 CLBs, supporting designs that require up to 164 user I/O pins and approximately 16,000 gates.
Designed for commercial-grade applications, the device operates from a 4.75 V to 5.25 V supply and across a 0 °C to 85 °C temperature range. It is RoHS compliant and supplied in a surface-mount package suitable for standard assembly processes.
Key Features
- Programmable Logic — 324 CLBs and 1,296 logic elements provide the core programmable fabric, supporting approximately 16,000 gates for combinational and sequential logic.
- I/O Capacity — 164 user I/O pins enable broad external interfacing for bus, control, or peripheral connections.
- Package and Mounting — 208‑BFQFP exposed pad (supplier package: 208‑PQFP, 28×28) in a surface-mount form factor for compact board integration and thermal conduction through the exposed pad.
- Power and Voltage — Single supply operation from 4.75 V to 5.25 V simplifies power rail requirements for 5 V systems.
- Operating Range — Commercial-grade operation specified from 0 °C to 85 °C for deployment in standard commercial environments.
- Regulatory Compliance — RoHS compliant to meet lead‑free assembly and environmental requirements.
- Memory Architecture — Total RAM bits: 0; logic resources and CLBs are the primary on-chip capabilities for implementing custom logic functions.
Typical Applications
- Interface and Glue Logic — Use the 164 I/O pins to implement board-level glue logic, bus adapters, and protocol bridging between digital subsystems.
- Control and Sequencing — Implement custom control state machines and sequencing logic that leverage the device's CLBs and logic element count.
- Prototyping and Embedded Systems — Suitable for commercial embedded designs that require moderate programmable logic density within a 5 V supply environment and standard temperature range.
Unique Advantages
- Balanced Logic Density: 1,296 logic elements and 324 CLBs provide a mid-range logic resource set for implementing custom digital functions without excessive device overhead.
- High I/O Count: 164 user I/Os allow flexible interfacing options, reducing the need for external IO expanders in many designs.
- Standard 5 V Support: Operation across 4.75 V–5.25 V simplifies integration into existing 5 V power architectures.
- Exposed Pad Package: The 208‑BFQFP with exposed pad aids thermal management and supports reliable surface-mount assembly.
- Commercial Temperature and RoHS Compliance: Rated for 0 °C–85 °C and RoHS compliant to meet common commercial product requirements.
Why Choose XC5210-5PQG208C?
The XC5210-5PQG208C delivers a pragmatic balance of programmable logic resources, I/O capacity, and standard packaging for commercial electronic designs. Its 1,296 logic elements, 324 CLBs, and 164 I/Os make it well suited for designers needing moderate complexity custom logic, interface control, or board-level glue functionality within a 5 V system.
With a 208‑lead BFQFP exposed pad package and RoHS compliance, this FPGA supports compact board layouts and standard manufacturing flows while meeting commercial environmental requirements. It is a straightforward choice for teams building reliable, scalable digital logic into commercial products.
Request a quote or submit an inquiry to discuss pricing, availability, and how the XC5210-5PQG208C can fit your next design.

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