XCS10XL-4CS144C
| Part Description |
Spartan®-XL Field Programmable Gate Array (FPGA) IC 112 6272 466 144-TFBGA, CSPBGA |
|---|---|
| Quantity | 110 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-LCSBGA (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-TFBGA, CSPBGA | Number of I/O | 112 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 196 | Number of Logic Elements/Cells | 466 | ||
| Number of Gates | 10000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6272 |
Overview of XCS10XL-4CS144C – Spartan®-XL FPGA, 144-TFBGA package
The XCS10XL-4CS144C is a Spartan®-XL field programmable gate array (FPGA) in a compact 144-TFBGA (CSPBGA) package. It provides a small, surface-mount programmable logic option with 466 logic elements, on-chip embedded memory, and up to 112 general-purpose I/O lines.
Designed for space-constrained electronic designs that require configurable logic, the device offers a balance of logic density, I/O count, and low-voltage operation (3 V to 3.6 V) for commercial-temperature applications (0 °C to 85 °C).
Key Features
- Logic Capacity Provides 466 logic elements suitable for implementing glue logic, control functions, and moderate combinational/sequential logic.
- Embedded Memory Includes approximately 6,272 bits of on-chip RAM for small buffers, FIFOs, or state storage.
- I/O Resources Up to 112 I/O pins enable flexible interfacing to external devices and buses.
- Package & Mounting Available in a 144-TFBGA, CSPBGA package (supplier device package: 144-LCSBGA, 12×12) and designed for surface-mount assembly.
- Power Operates from a 3 V to 3.6 V supply range, accommodating common system power rails.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Standards Compliance RoHS compliant for lead-free manufacturing and environmental compliance.
- Gate Equivalent Approximately 10,000 logic gates for estimating integration scope.
Typical Applications
- Interface Bridging Implement protocol translation and signal conditioning where a compact programmable interface is required between subsystem components.
- Control Logic Replace discrete glue logic with configurable control blocks for state machines, sequencers, and peripheral management.
- Prototyping and Evaluation Use as a small, low-pin-count FPGA for early-stage algorithm validation and functional prototyping.
- I/O Expansion Provide additional digital I/O and simple bus interconnect functions in space-limited designs.
Unique Advantages
- Compact package footprint 144-TFBGA (CSPBGA) packaging and surface-mount mounting make it well suited to dense PCB layouts and compact assemblies.
- Balanced logic and memory 466 logic elements combined with ~6,272 bits of embedded RAM support modest logic implementations without external memory.
- Generous I/O 112 I/O pins provide flexibility for connecting multiple peripherals or buses without large packages.
- Simple power requirements Single 3 V to 3.6 V supply simplifies power rail design in many commercial systems.
- Commercial temperature rating Specified for 0 °C to 85 °C operation to match typical consumer and commercial electronics environments.
- RoHS compliant Supports lead-free assembly and regulatory environmental requirements.
Why Choose XCS10XL-4CS144C?
The XCS10XL-4CS144C positions itself as a compact, practical FPGA choice for designers who need programmable logic in a small form factor. Its combination of 466 logic elements, approximately 6,272 bits of embedded RAM, and up to 112 I/O pins offers a flexible building block for control logic, interface bridging, and I/O expansion in commercial-temperature systems.
This device suits teams looking to reduce component count by consolidating discrete logic into a single programmable device while maintaining straightforward power and packaging requirements. Its RoHS compliance and surface-mount 144-TFBGA footprint support modern manufacturing workflows and compact PCB designs.
Request a quote or submit an inquiry to receive pricing and availability for the XCS10XL-4CS144C. Our team can provide lead-time and purchasing information tailored to your project needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








