AS4C4M16D1-5TINTR
| Part Description |
IC DRAM 64MBIT PAR 66TSOP II |
|---|---|
| Quantity | 369 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C4M16D1-5TINTR - 64Mbit DDR SDRAM with Extended Temperature Range
The AS4C4M16D1-5TINTR from Alliance Memory is a 64-megabit synchronous dynamic random access memory (SDRAM) utilizing DDR (Double Data Rate) technology. Organized as 4M x 16, this parallel-interface DRAM delivers reliable performance across an extended industrial temperature range of -40°C to 85°C. Designed for embedded systems and industrial applications requiring proven memory solutions, the AS4C4M16D1-5TINTR offers a balance of capacity, speed, and environmental robustness.
With a 200MHz clock frequency and 7ns access time, this DDR SDRAM provides responsive data throughput for systems requiring moderate memory bandwidth. The wide operating temperature range and standard 66-TSOP II package make it well-suited for deployments in challenging thermal environments.
Key Features
- DDR SDRAM Technology - Double data rate architecture transfers data on both clock edges, maximizing bandwidth efficiency compared to single data rate memory.
- 4M x 16 Organization - The 64-megabit capacity is organized as 4,194,304 words by 16 bits, providing flexible data width for various system architectures.
- 200MHz Clock Operation - Operates at a clock frequency of 200MHz with a 7ns access time, delivering responsive performance for industrial control and embedded applications.
- Extended Temperature Range - Rated for -40°C to 85°C ambient operation, ensuring reliable functionality across industrial and harsh environment deployments.
- Standard 66-TSOP II Package - The 66-pin Thin Small Outline Package Type II with 10.16mm width offers a compact footprint and proven manufacturability for volume production.
- 2.3V to 2.7V Operation - Low-voltage supply range supports power-efficient system designs while maintaining compatibility with standard logic levels.
Typical Applications
- Industrial Automation - This DDR SDRAM provides reliable memory for programmable logic controllers (PLCs), HMI panels, and process control systems where extended temperature tolerance ensures consistent operation in factory floor environments.
- Embedded Computing Systems - Suitable for single-board computers and embedded processors requiring moderate memory capacity with parallel interface compatibility, particularly in legacy system maintenance or cost-sensitive designs.
- Test and Measurement Equipment - Provides buffering and data storage capabilities for instrumentation and measurement devices operating across varied environmental conditions.
- Legacy System Support - Offers a replacement or spare inventory option for existing designs utilizing DDR SDRAM technology, helping extend the operational life of fielded systems.
Unique Advantages
- Industrial Temperature Qualification: The -40°C to 85°C operating range eliminates the need for additional thermal management in many industrial deployments, simplifying system design.
- Proven DDR Technology: Leverages mature DDR SDRAM architecture with established driver support and predictable electrical characteristics, reducing development risk.
- Parallel Interface Compatibility: Directly interfaces with processors and controllers using traditional parallel memory buses, avoiding the complexity of serial memory protocols.
- Standard Package Footprint: The industry-standard 66-TSOP II package enables straightforward PCB layout and compatibility with automated assembly processes.
- Moderate Density Option: The 64Mbit capacity provides sufficient memory for many control and embedded applications without overprovisioning, helping manage BOM costs.
Why Choose AS4C4M16D1-5TINTR?
The AS4C4M16D1-5TINTR addresses the needs of industrial and embedded system designers requiring DDR SDRAM memory with extended temperature capability. While this component carries an obsolete lifecycle status, it remains relevant for system maintenance, field spares inventory, and designs where continuity with existing architectures is prioritized. Engineers supporting legacy platforms or managing long-lifecycle products will find this device useful for sustaining fielded equipment.
For new designs, designers should evaluate current-generation memory technologies and consult with Alliance Memory regarding recommended alternatives that offer improved availability and lifecycle positioning.
Contact Us for Availability and Alternatives
Given the obsolete status of this component, we recommend contacting our technical sales team to discuss availability, minimum order quantities, and recommended migration paths to current-generation memory solutions. Our team can assist with cross-reference options and design-in support for alternative components that meet your performance and environmental requirements.