AS4C4G8D4-62BCNTR
| Part Description |
DDR4, 32GB, 4G X 8, 1.2V, 78-BAL |
|---|---|
| Quantity | 272 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 40 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 78-FBGA (7.5x11) | Memory Format | DRAM | Technology | SDRAM - DDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | 13.75 ns | Grade | Extended / Automotive-like | ||
| Clock Frequency | 1.6 GHz | Voltage | 1.14V ~ 1.26V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 78-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of AS4C4G8D4-62BCNTR - 32Gb DDR4 SDRAM
The AS4C4G8D4-62BCNTR from Alliance Memory is a 32-gigabit DDR4 synchronous DRAM configured as 4G x 8, operating at 1.2V nominal voltage. This memory device delivers 1600MHz clock frequency with 13.75ns access time, making it suitable for applications requiring high-density, high-speed memory in a compact 78-FBGA package. Designed for extended temperature operation from 0°C to 95°C (TC), this SDRAM serves embedded systems, industrial controllers, and computing platforms where thermal tolerance and reliable performance are essential.
Key Features
- High-Density Memory Architecture - 32Gb capacity organized as 4 billion words by 8 bits provides substantial data storage in a single device, reducing component count in multi-gigabyte memory subsystems.
- DDR4 SDRAM Technology - Delivers 1600MHz clock frequency with synchronous operation, supporting high-bandwidth data transfers for modern processing architectures while maintaining power efficiency at 1.14V to 1.26V supply voltage range.
- Extended Temperature Range - Operates reliably across 0°C to 95°C case temperature, accommodating industrial and embedded applications where ambient conditions vary beyond commercial temperature limits.
- Compact FBGA Package - 78-ball fine-pitch BGA measuring 7.5mm x 11mm minimizes PCB footprint while providing parallel memory interface connectivity for high-speed data access.
- Parallel Memory Interface - Standard DDR4 parallel interface simplifies integration with processors, FPGAs, and controllers that support DDR4 memory protocols without requiring additional interface translation.
Typical Applications
- Industrial Computing Systems - This DDR4 SDRAM provides high-capacity working memory for industrial PCs and embedded controllers where extended temperature tolerance ensures reliable operation in factory floor and harsh environment installations.
- Network Infrastructure Equipment - Delivers the high-bandwidth volatile memory required by routers, switches, and telecommunications equipment for packet buffering and routing table storage with 1600MHz performance.
- Data Acquisition Systems - Serves as buffer memory in instrumentation and test equipment where 32Gb capacity accommodates large data sets captured at high sampling rates before transfer to permanent storage.
- Embedded Computing Platforms - Supports memory requirements of ARM, x86, and FPGA-based designs in applications ranging from edge computing to machine vision systems where compact packaging and extended temperature operation are critical.
Unique Advantages
- Simplified Memory Subsystem Design: High 32Gb density per device reduces the number of memory ICs required to achieve multi-gigabyte system capacity, lowering BOM cost and simplifying PCB routing.
- Extended Operating Temperature Capability: 0°C to 95°C (TC) specification expands deployment options beyond standard commercial temperature components, eliminating the need for industrial-grade alternatives in many applications.
- Industry-Standard DDR4 Interface: Compatibility with established DDR4 protocols and timing specifications accelerates design integration and leverages existing memory controller IP without custom interface development.
- Power-Efficient Operation: 1.2V nominal voltage and DDR4 architecture deliver performance with lower power consumption compared to earlier DDR3 technology, reducing thermal management requirements.
- Compact Physical Footprint: 78-FBGA package in 7.5mm x 11mm dimensions provides space-efficient memory solution for size-constrained designs while maintaining parallel interface bandwidth.
- Active Lifecycle Status: Current production availability supports new designs and long-term projects without obsolescence concerns during development and deployment phases.
Why Choose AS4C4G8D4-62BCNTR?
This Alliance Memory DDR4 SDRAM is engineered for embedded and industrial applications where high memory capacity, extended temperature operation, and compact packaging converge. The 32Gb density in a single device streamlines system architecture while the 0°C to 95°C specification addresses real-world deployment scenarios in industrial controls, network infrastructure, and ruggedized computing platforms. With 1600MHz DDR4 performance and industry-standard interface compatibility, this memory device balances bandwidth requirements with straightforward integration into existing processor and FPGA ecosystems.
Design teams benefit from reduced component count, simplified PCB layouts, and active lifecycle status that supports both current production and future procurement. The combination of volatile SDRAM technology with extended temperature tolerance makes this device suitable for applications requiring fast read/write access in environments where standard commercial-grade components may not meet operational specifications.
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