AS4C32M8SA-6TINTR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 91 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C32M8SA-6TINTR - 256Mbit Parallel SDRAM

The AS4C32M8SA-6TINTR from Alliance Memory is a 256Mbit synchronous DRAM offering a 32M x 8 memory organization with a parallel interface. Operating at clock frequencies up to 166MHz with a fast 5.5ns access time, this SDRAM delivers reliable performance for embedded systems requiring moderate-density memory. With an extended industrial temperature range of -40°C to 85°C, it provides robust operation in challenging environments.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 32M x 8, providing flexible byte-wide data access for efficient system integration.
  • Performance Specifications - 166MHz clock frequency with 5.5ns access time ensures responsive memory operations for time-sensitive applications.
  • Operating Voltage - Standard 3V to 3.6V supply voltage simplifies power design and enables compatibility with common embedded system architectures.
  • Temperature Range - Industrial-grade -40°C to 85°C operating range supports deployment in factory automation, outdoor equipment, and other harsh environments.
  • Package Configuration - 54-pin TSOP II package with 10.16mm width offers a proven form factor for surface-mount assembly.
  • Interface Type - Parallel SDRAM interface provides straightforward integration with processors and controllers supporting synchronous memory protocols.

Typical Applications

  • Industrial Automation - This SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the extended temperature range ensures consistent operation in factory floor environments subject to heat and cold extremes.
  • Embedded Computing Systems - The 256Mbit capacity and parallel interface make this memory suitable for embedded processors in industrial PCs, edge computing devices, and control systems that require moderate memory density with predictable synchronous timing.
  • Networking Equipment - The fast access time and reliable operation support packet buffering and data handling in routers, switches, and network appliances deployed in non-climate-controlled locations.
  • Test and Measurement Instruments - The stable performance across temperature variations makes this SDRAM appropriate for portable and benchtop measurement equipment that must operate reliably in field and laboratory settings.
  • Automotive Infotainment - While not automotive-qualified, the industrial temperature range and proven SDRAM architecture can support infotainment systems and dashboard displays in commercial vehicles and off-highway equipment.

Unique Advantages

  • Extended Temperature Tolerance: The -40°C to 85°C range eliminates the need for thermal management in many industrial applications, reducing system complexity and cost.
  • Proven SDRAM Technology: Synchronous DRAM architecture offers predictable timing characteristics and broad ecosystem support, simplifying design validation and reducing development risk.
  • Standard Voltage Operation: 3V to 3.6V compatibility aligns with common embedded system power rails, minimizing the need for dedicated voltage regulation.
  • Moderate Density Sweet Spot: 256Mbit capacity addresses applications where lower-density parts are insufficient but higher-capacity DDR solutions would be over-specified and more expensive.
  • Surface-Mount Package: The TSOP II format enables automated assembly while the 54-pin configuration provides adequate signal routing without excessive pin count.
  • Active Lifecycle Status: Current production availability supports new designs and provides supply confidence for long product lifecycles.

Why Choose AS4C32M8SA-6TINTR?

The AS4C32M8SA-6TINTR addresses the needs of industrial and embedded system designers who require reliable memory with extended temperature operation but do not need the complexity or cost of DDR technologies. Its 256Mbit capacity fills a practical niche for applications like industrial controllers, edge computing devices, and networking equipment where moderate memory density suffices. The parallel SDRAM interface simplifies integration with a wide range of processors and microcontrollers that support synchronous memory protocols.

With active production status and a proven TSOP II package, this component supports both new designs and ongoing production requirements. The industrial temperature range and standard voltage operation reduce system-level design complexity, while the 166MHz performance provides adequate bandwidth for most embedded control and data handling applications.

Contact Us for Pricing and Availability

Request a quote for the AS4C32M8SA-6TINTR or contact our sales team to discuss volume pricing, lead times, and technical support for your specific application requirements.

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