AS4C32M8D1-5TCNTR

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 29 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C32M8D1-5TCNTR - 256Mbit DDR SDRAM Memory IC

The AS4C32M8D1-5TCNTR is a 256-megabit DDR SDRAM (Synchronous Dynamic Random Access Memory) integrated circuit from Alliance Memory, Inc. Organized as 32M x 8, this volatile memory device operates at 200MHz clock frequency with 7ns access time. Designed for commercial temperature applications (0°C to 70°C), it provides cost-effective, high-speed memory for embedded systems and legacy equipment requiring DDR1 support.

Key Features

  • DDR SDRAM Architecture - Delivers double data rate performance with 200MHz operation and 7ns access time for efficient data throughput in embedded applications.
  • 256Mbit Density - 32M x 8 organization provides sufficient memory capacity for industrial controllers, network equipment, and consumer electronics.
  • Standard Voltage Operation - Operates on 2.3V to 2.7V supply, compatible with standard DDR1 system designs.
  • Commercial Temperature Range - Qualified for 0°C to 70°C ambient operation, suitable for indoor industrial and commercial environments.
  • Parallel Interface - Direct parallel memory interface enables straightforward integration with processors and memory controllers.
  • 66-TSOP II Package - Industry-standard 10.16mm width TSOP II package simplifies PCB layout and supports high-density board designs.

Typical Applications

  • Legacy System Upgrades - This DDR1 SDRAM enables memory expansion and replacement in existing equipment where DDR1 support is required, extending the operational life of legacy platforms.
  • Industrial Control Systems - Provides reliable volatile memory for PLCs, HMIs, and industrial computers where the commercial temperature range meets environmental requirements.
  • Network Equipment - Supports buffering and packet processing tasks in routers, switches, and network appliances that utilize DDR1 memory architectures.
  • Consumer Electronics - Suitable for set-top boxes, digital displays, and embedded devices requiring cost-effective DDR1 memory solutions.
  • Embedded Computing - Serves as system memory in embedded boards and single-board computers designed around DDR1-compatible processors.

Unique Advantages

  • Legacy Platform Support: Enables continued sourcing for DDR1-based designs, reducing the need for costly system redesigns when original components become unavailable.
  • Proven DDR1 Technology: Leverages mature, well-characterized SDRAM technology that simplifies design validation and reduces integration risk.
  • Standard Footprint: The 66-TSOP II package matches industry-standard dimensions, allowing drop-in replacement for compatible memory devices.
  • Straightforward Integration: Parallel interface and standard DDR1 timing requirements minimize design complexity and controller development effort.
  • Cost-Effective Density: 256Mbit capacity provides adequate memory for many embedded applications at an economical price point.
  • Simplified Bill of Materials: Single-chip solution reduces component count compared to using multiple lower-density devices.

Why Choose AS4C32M8D1-5TCNTR?

The AS4C32M8D1-5TCNTR addresses the ongoing need for DDR1 SDRAM components in legacy system maintenance and embedded designs built around DDR1 memory controllers. For engineers maintaining or upgrading existing platforms, this device provides a reliable source for compatible memory components when original parts reach end-of-life status. The standard 200MHz operation and 32M x 8 organization align with common DDR1 system architectures, simplifying integration.

This memory IC is particularly valuable for industrial equipment manufacturers and OEMs who need to support fielded systems with extended service lives. While the component carries an obsolete lifecycle status, its availability supports critical applications where system redesign is not economically viable. The commercial temperature rating suits indoor industrial environments, office equipment, and consumer products.

Contact Us for Availability

For current pricing, availability, and technical support for the AS4C32M8D1-5TCNTR, please contact our sales team. We can assist with volume requirements, alternative sourcing options, and technical specifications to ensure this memory solution meets your application needs.

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