AS4C32M8D1-5TINTR

The AS4C32M8D1-5TINTR is a 256-megabit synchronous dynamic random-access memory (DRAM) device utilizing DDR (Double Data Rate) SDRAM technology. Organized as 32M x 8, this memory IC delivers reliable parallel interface data storage for embedded systems, computing platforms, and industrial equipment operating across extended temperature ranges.

Key Features

• Memory Architecture - 256Mbit capacity organized as 32M x 8 with DDR SDRAM technology for double data rate transfer on both clock edges.
• Clock Frequency - Operates at 200MHz clock frequency with 7ns access time and 15ns write cycle time for responsive data operations.
• Power Supply - Standard 2.3V to 2.7V supply voltage range compatible with common embedded system power designs.
• Temperature Range - Extended -40°C to 85°C operating temperature range (TA) supports deployment in harsh industrial environments.
• Interface - Parallel memory interface enables straightforward integration with processors and controllers using conventional memory buses.
• Package - 66-TSOP II (0.400", 10.16mm width) surface-mount package offers compact board footprint.

Typical Applications

• Industrial Control Systems - This DDR SDRAM provides working memory for programmable logic controllers (PLCs) and distributed control systems where extended temperature tolerance ensures reliable operation in factory floor conditions.
• Embedded Computing - The parallel interface and standard DDR architecture make this memory suitable for embedded processors and system-on-module designs requiring cost-effective volatile storage.
• Legacy System Support - As older embedded platforms require maintenance and repair, this DDR1 SDRAM serves as replacement memory for systems originally designed with similar specifications.
• Test and Measurement Equipment - Industrial test equipment benefits from the extended temperature rating and reliable data buffering for acquisition and analysis operations.

Unique Advantages

• Extended Temperature Operation: The -40°C to 85°C rating eliminates the need for thermal management in many industrial installations, reducing system complexity.
• Standard DDR Architecture: Leverages widely-supported DDR SDRAM controller implementations, simplifying firmware development and reducing time-to-market.
• Compact Surface-Mount Package: The 66-TSOP II form factor balances pin count requirements with board space efficiency for space-constrained designs.
• Parallel Interface Simplicity: Direct memory bus connection avoids protocol overhead associated with serial interfaces, streamlining hardware design.
• 200MHz Operation: Clock frequency supports moderate-bandwidth applications without requiring high-speed signal integrity considerations of faster memory technologies.

Why Choose AS4C32M8D1-5TINTR?

This DDR SDRAM addresses the requirements of industrial and embedded systems where proven memory technology, extended temperature operation, and parallel interface compatibility are essential. The 256Mbit capacity provides sufficient working memory for control, processing, and buffering tasks in cost-sensitive applications.

For system designers maintaining legacy platforms or developing new industrial equipment with extended environmental requirements, this memory device offers straightforward integration with established DDR controller architectures and reliable performance across demanding temperature conditions.

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