AS4C4G8D4-62BCN

DDR4, 32GB, 4G X 8, 1.2V, 78-BAL

Part Description	DDR4, 32GB, 4G X 8, 1.2V, 78-BAL
Quantity	493 Available (as of May 5, 2026)

Product Category	Memory
Manufacturer	Alliance Memory, Inc.
Manufacturing Status	Active
Manufacturer Standard Lead Time	40 Weeks
Datasheet	Download Datasheet

Specifications & Environmental

Device Package	78-FBGA (7.5x11)	Memory Format	DRAM	Technology	SDRAM - DDR4
Memory Size	32 Gbit	Access Time	13.75 ns	Grade	Extended / Automotive-like
Clock Frequency	1.6 GHz	Voltage	1.14V ~ 1.26V	Memory Type	Volatile
Operating Temperature	0°C ~ 95°C (TC)	Write Cycle Time Word Page	N/A	Packaging	78-TFBGA
Mounting Method	Volatile	Memory Interface	Parallel	Memory Organization	4G x 8
Moisture Sensitivity Level	3 (168 Hours)	RoHS Compliance	ROHS3 Compliant	REACH Compliance	REACH Unaffected
Qualification	N/A	ECCN	EAR99	HTS Code	8542.32.0036

Overview of AS4C4G8D4-62BCN - 32Gb DDR4 SDRAM

The AS4C4G8D4-62BCN is a high-density DDR4 SDRAM from Alliance Memory, offering 32Gb capacity in a 4G x 8 organization. Operating at 1.2V nominal supply voltage, this memory device delivers efficient performance for systems requiring substantial data storage with DDR4-class bandwidth.

Designed for parallel memory interface applications, this SDRAM provides reliable operation across a wide temperature range, making it suitable for commercial and light industrial environments.

Key Features

High-Density Memory - 32Gb capacity organized as 4G x 8 provides substantial memory depth for data-intensive applications requiring large buffers and storage.
DDR4 Technology - Leverages DDR4 SDRAM architecture for improved data rates and power efficiency compared to previous DDR generations.
Low Voltage Operation - Operates within 1.14V to 1.26V supply range, reducing power consumption and thermal output in space-constrained designs.
1600MHz Clock Frequency - Supports up to 1600MHz operation for high-bandwidth data transfer in demanding applications.
Wide Temperature Range - Operates from 0°C to 95°C case temperature, enabling deployment in varied environmental conditions.
Compact Package - 78-TFBGA package (7.5mm x 11mm) provides high density in a surface-mount form factor suitable for automated assembly.

Typical Applications

Networking Equipment - This DDR4 SDRAM provides packet buffering and routing table storage for switches and routers where high memory bandwidth supports line-rate processing of network traffic.
Industrial Computing - Reliable memory for embedded computers and industrial PCs where the extended temperature range ensures consistent operation in factory automation and process control systems.
Server and Storage Systems - High-density memory expansion for servers and storage controllers requiring large data caches to improve I/O performance and throughput.
Telecommunications Infrastructure - Base station controllers and telecom equipment benefit from the combination of high capacity and DDR4 bandwidth for signal processing and data aggregation tasks.

Unique Advantages

Simplified Power Design: The 1.2V nominal operation reduces power supply complexity and allows integration with standard DDR4 voltage rails already present in modern system designs.
Design Longevity: Active lifecycle status ensures long-term availability for products with extended production cycles and service requirements.
Parallel Interface Compatibility: Standard DDR4 parallel interface ensures compatibility with a wide range of memory controllers and processors without requiring specialized interconnects.
Thermal Headroom: 95°C maximum case temperature rating provides margin for operation in enclosed systems with limited airflow or elevated ambient conditions.
High Integration: 32Gb density in a single package reduces component count and PCB area compared to using multiple lower-density devices.

Why Choose AS4C4G8D4-62BCN?

The AS4C4G8D4-62BCN represents an effective solution for designers requiring high-density DDR4 memory with proven reliability. Alliance Memory's focus on memory products ensures dedicated support and consistent supply for memory-critical applications.

This device is well-suited for new designs requiring substantial memory capacity in a compact footprint, as well as for system upgrades where DDR4 performance and density improvements can extend product competitiveness.