AS4C4M16D1-5TCN

IC DRAM 64MBIT PAR 66TSOP II
Part Description

IC DRAM 64MBIT PAR 66TSOP II

Quantity 496 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size64 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C4M16D1-5TCN - 64Mbit DDR SDRAM with 200MHz Clock Frequency

The AS4C4M16D1-5TCN from Alliance Memory is a 64-megabit DDR SDRAM offering parallel memory interface capabilities for embedded systems requiring fast, volatile data storage. Built on DDR SDRAM technology, this memory device is organized as 4M x 16 and operates at clock frequencies up to 200MHz with a 7ns access time. Designed for commercial temperature range applications from 0°C to 70°C, it provides reliable data buffering and storage for applications where cost-effective, high-speed memory is essential.

Key Features

  • Memory Core - 64-megabit DDR SDRAM organized as 4M x 16, providing flexible word-width access for diverse system architectures.
  • Performance - 200MHz clock frequency with 7ns access time delivers fast data throughput suitable for time-sensitive applications.
  • Power Supply - Operates on 2.3V to 2.7V supply voltage, enabling compatibility with low-voltage digital systems and reducing overall power consumption.
  • Interface - Parallel memory interface allows direct connection to microcontrollers, processors, and FPGAs without additional protocol conversion.
  • Package - Available in 66-TSOP II (0.400", 10.16mm width) surface-mount package for efficient board-level integration.
  • Operating Range - Commercial temperature range of 0°C to 70°C (TA) suits standard indoor electronic equipment environments.

Typical Applications

  • Consumer Electronics - This DDR SDRAM serves as main memory or frame buffer storage in set-top boxes, digital cameras, and portable media players where moderate speed and cost efficiency are priorities.
  • Networking Equipment - The parallel interface and 200MHz operation make this memory suitable for packet buffering in routers, switches, and network interface cards operating in climate-controlled environments.
  • Industrial Controllers - Commercial-grade temperature tolerance allows deployment in HMI terminals, data acquisition systems, and programmable logic controllers installed in controlled industrial settings.
  • Embedded Computing - The 4M x 16 organization provides efficient memory expansion for embedded processors in kiosks, point-of-sale terminals, and building automation systems requiring temporary data storage.

Unique Advantages

  • Cost-Effective DDR Performance: Delivers double data rate throughput without the complexity and cost of newer DDR2 or DDR3 technologies, optimizing bill-of-materials for price-sensitive designs.
  • Simplified Integration: Parallel interface eliminates the need for serial protocol controllers or complex timing management, reducing design effort and component count.
  • Flexible Memory Width: The 4M x 16 organization matches common bus widths in 16-bit and 32-bit processor systems, minimizing external glue logic requirements.
  • Low-Voltage Operation: The 2.3V to 2.7V supply range reduces system power consumption and heat generation compared to legacy 3.3V SDRAM devices.
  • Standard Footprint: The 66-TSOP II package is widely supported by assembly equipment and PCB design tools, streamlining manufacturing and layout processes.

Why Choose AS4C4M16D1-5TCN?

The AS4C4M16D1-5TCN represents a proven DDR SDRAM solution for designs where established technology, straightforward integration, and cost efficiency take precedence over cutting-edge performance. Its 200MHz operation and 7ns access time provide sufficient bandwidth for applications such as embedded controllers, consumer devices, and networking equipment operating in standard commercial environments. The parallel interface and industry-standard TSOP II packaging reduce both design complexity and manufacturing risk.

This memory device is ideally suited for commercial products with moderate performance requirements, where a balance of speed, power efficiency, and affordability is needed. Engineers working on cost-sensitive embedded systems will find the AS4C4M16D1-5TCN offers reliable volatile storage without the overhead of more advanced memory technologies.

Contact Us for Pricing and Availability

To request a quote for the AS4C4M16D1-5TCN or discuss volume pricing and lead times, please contact our sales team. We can provide technical support, lifecycle information, and guidance on integration into your specific application.

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