AS4C64M8D1-5TCNTR
| Part Description |
IC DRAM 512MBIT PAR 66TSOP II |
|---|---|
| Quantity | 1,727 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C64M8D1-5TCNTR - 512Mbit DDR SDRAM IC
The AS4C64M8D1-5TCNTR from Alliance Memory, Inc. is a 512Mbit DDR SDRAM organized as 64M x 8, delivering reliable synchronous dynamic memory for embedded systems and computing applications. With 200MHz clock frequency and 7ns access time, this DDR memory provides fast data throughput for applications requiring efficient memory access in commercial temperature ranges.
Key Features
- Memory Architecture - 512Mbit capacity organized as 64M x 8, providing flexible data width configuration for various system designs.
- DDR SDRAM Technology - Double data rate synchronous DRAM transfers data on both rising and falling clock edges, effectively doubling bandwidth compared to standard SDRAM.
- 200MHz Clock Frequency - Operates at 200MHz clock with 7ns access time, enabling fast read and write operations for performance-sensitive applications.
- Parallel Interface - Standard parallel memory interface simplifies integration with existing DDR controller designs and microprocessor systems.
- Commercial Temperature Range - Specified for 0°C to 70°C operation, suitable for standard commercial and consumer electronics environments.
- Low Voltage Operation - 2.3V to 2.7V supply voltage reduces power consumption and heat generation in memory subsystems.
- 66-TSOP II Package - Industry-standard 66-pin TSOP II (10.16mm width) footprint enables board layout compatibility and ease of sourcing.
Typical Applications
- Embedded Computing Systems - This DDR SDRAM serves as main memory in single-board computers, industrial controllers, and embedded processors where 512Mbit capacity and 200MHz performance support multitasking operating systems and application execution.
- Networking Equipment - The parallel DDR interface and fast access time make this memory suitable for routers, switches, and communication devices that require buffer memory for packet processing and data routing operations.
- Consumer Electronics - Commercial temperature rating and standard voltage operation enable use in set-top boxes, digital displays, and home automation devices where cost-effective memory solutions are needed.
- Test and Measurement Instruments - The 64M x 8 organization provides appropriate capacity and data width for oscilloscopes, data loggers, and analysis equipment requiring temporary data storage during measurement operations.
- Legacy System Upgrades - Standard DDR SDRAM interface and TSOP II packaging allow retrofitting or capacity expansion in existing designs originally built around DDR1 memory technology.
Unique Advantages
- Active Lifecycle Status: Current production availability ensures long-term supply continuity for new designs and ongoing manufacturing requirements.
- Standard DDR1 Interface: Proven technology with mature controller support reduces development risk and shortens time-to-market compared to newer memory technologies.
- Balanced Capacity and Performance: 512Mbit density provides sufficient memory for many embedded applications without over-provisioning, helping optimize system cost.
- Proven Reliability: DDR SDRAM technology has extensive field history and well-understood behavior patterns, reducing validation effort in product development cycles.
- Industry-Standard Package: 66-TSOP II form factor ensures compatibility with standard PCB footprints and automated assembly processes.
- Accessible Pricing: Mature DDR1 technology typically offers favorable pricing compared to newer DDR generations for applications where extreme bandwidth is not required.
Why Choose AS4C64M8D1-5TCNTR?
The AS4C64M8D1-5TCNTR addresses the needs of commercial embedded systems requiring proven DDR SDRAM technology with reliable supply. Its 200MHz operation and 7ns access time deliver sufficient performance for control systems, networking, and consumer applications while maintaining power efficiency through 2.3V-2.7V operation. The standard parallel interface ensures compatibility with widely available DDR controllers and simplifies migration from existing DDR1 designs.
This memory IC is well-suited for designs prioritizing supply continuity, cost optimization, and design reuse over cutting-edge bandwidth requirements. The active lifecycle status and standard package provide confidence for both new product development and sustaining engineering of established platforms.
Get a Quote
Contact our sales team to request pricing, lead times, and volume availability for the AS4C64M8D1-5TCNTR. Our technical support staff can assist with integration questions and provide additional product documentation to support your design process.