AS4C64M8D1-5TINTR
| Part Description |
IC DRAM 512MBIT PAR 66TSOP II |
|---|---|
| Quantity | 630 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of AS4C64M8D1-5TINTR - 512Mbit DDR SDRAM Memory IC
The AS4C64M8D1-5TINTR is a 512Mbit Double Data Rate (DDR) SDRAM from Alliance Memory, Inc. Organized as 64M x 8, this volatile memory IC delivers reliable parallel data storage and retrieval for embedded systems requiring high-speed synchronous DRAM. Operating at 200MHz clock frequency with a 5ns access time, this DDR SDRAM provides the performance needed for data-intensive applications while maintaining industrial temperature tolerance.
Key Features
- Memory Architecture - 512Mbit DDR SDRAM organized as 64M x 8, providing efficient data paths for byte-wide operations and simplified memory controller design.
- Performance Specifications - 200MHz clock frequency with 5ns access time and 15ns write cycle time, enabling fast data throughput for real-time processing applications.
- Power Supply - 2.3V to 2.7V operating voltage range supports low-power designs and compatibility with modern digital logic standards.
- Temperature Range - Extended -40°C to 85°C (TA) operating temperature ensures reliable operation in industrial environments and harsh thermal conditions.
- Package Format - 66-pin TSOP II (0.400", 10.16mm width) package provides a compact footprint for space-constrained PCB layouts.
- Interface - Parallel memory interface with synchronous DDR operation doubles data transfer efficiency compared to single data rate SDRAM.
Typical Applications
- Industrial Automation - This DDR SDRAM provides high-speed volatile memory for PLCs, HMIs, and motion control systems where extended temperature tolerance ensures reliable operation across factory floor conditions.
- Communications Equipment - The parallel interface and 200MHz clock frequency support buffering and data processing in routers, switches, and network infrastructure requiring consistent performance.
- Embedded Computing - Compact TSOP II packaging and standard DDR interface make this memory suitable for embedded processors and microcontroller-based systems with limited board space.
- Test and Measurement Instruments - Fast access times and industrial temperature rating enable data acquisition and signal processing in laboratory and field instruments operating under varying environmental conditions.
- Medical Devices - The reliable performance and extended temperature range support patient monitoring systems, diagnostic equipment, and other medical electronics requiring stable memory operation.
Unique Advantages
- Proven DDR Technology: Standard DDR SDRAM architecture ensures broad compatibility with existing memory controllers and reduces design risk in new projects.
- Industrial Temperature Grade: -40°C to 85°C operating range eliminates the need for additional thermal management in many industrial applications, simplifying system design.
- Compact Footprint: TSOP II package provides high pin density in a space-efficient form factor, optimizing PCB real estate for memory-intensive designs.
- Low Voltage Operation: 2.3V to 2.7V supply range reduces power consumption and heat generation, contributing to overall system efficiency and thermal performance.
- Byte-Wide Organization: 64M x 8 configuration aligns well with 8-bit and 16-bit processor architectures, simplifying address decoding and memory interface logic.
- Active Lifecycle Status: Ongoing availability supports both new designs and long-term production requirements, reducing obsolescence concerns for industrial products.
Why Choose AS4C64M8D1-5TINTR?
The AS4C64M8D1-5TINTR offers a balanced combination of performance, reliability, and industrial-grade specifications for embedded systems requiring proven DDR SDRAM technology. With its extended temperature range and compact packaging, this memory IC is well-suited for industrial control, communications infrastructure, and embedded computing applications where long-term availability and environmental resilience are essential design criteria.
Alliance Memory's focus on standard memory architectures ensures that the AS4C64M8D1-5TINTR integrates seamlessly with existing development tools and hardware platforms, reducing time-to-market for new products while maintaining the performance characteristics needed for data-intensive real-time applications.
Get a Quote
Contact our sales team to request pricing and availability for the AS4C64M8D1-5TINTR. Our technical support staff can assist with integration questions, reference designs, and volume pricing for production requirements.
