AS4C64M8D2-25BCN
| Part Description |
IC DRAM 512MBIT PARALLEL 60FBGA |
|---|---|
| Quantity | 5 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x10) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 400 ps | Grade | Commercial | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C64M8D2-25BCN - 512Mbit DDR2 SDRAM
The AS4C64M8D2-25BCN from Alliance Memory is a 512Mbit DDR2 SDRAM organized as 64M x 8 bits. This high-density memory device operates at 400MHz clock frequency with a parallel interface, making it suitable for embedded systems and computing applications requiring reliable volatile memory storage.
Featuring DDR2 technology with low voltage operation between 1.7V and 1.9V, this SDRAM delivers efficient power consumption while maintaining high-speed data access with 0.4ns access time.
Key Features
- Memory Density and Organization - 512Mbit capacity organized as 64M x 8 provides ample storage for data-intensive embedded applications with an 8-bit data bus width.
- DDR2 SDRAM Technology - Double Data Rate 2 architecture enables data transfer on both clock edges, effectively doubling throughput compared to single data rate memory.
- High-Speed Performance - 400MHz clock frequency with 0.4ns access time and 15ns write cycle time supports demanding real-time processing requirements.
- Low Voltage Operation - 1.7V to 1.9V supply voltage range reduces power consumption compared to legacy DDR memory, extending battery life in portable designs.
- Compact Package - 60-FBGA (8x10mm) form factor enables space-efficient PCB layouts in size-constrained applications.
- Commercial Temperature Range - Operates reliably from 0°C to 70°C, suitable for standard commercial and consumer electronics environments.
Typical Applications
- Embedded Computing Systems - This DDR2 SDRAM serves as main memory in embedded processors and SoCs where the 512Mbit density and 64M x 8 organization provide sufficient capacity for operating systems and application code execution.
- Networking Equipment - Routers, switches, and access points utilize this memory for packet buffering and routing table storage, benefiting from the high-speed 400MHz operation for low-latency data handling.
- Consumer Electronics - Set-top boxes, digital displays, and media players leverage the DDR2 interface for frame buffering and media processing with the low voltage operation helping meet energy efficiency requirements.
- Industrial Control Panels - HMI displays and control systems use this SDRAM for graphics buffering and data logging where the commercial temperature range meets typical indoor industrial environment needs.
Unique Advantages
- Second-Source Availability: Alliance Memory provides drop-in compatible alternatives to legacy DDR2 devices, reducing supply chain risk and ensuring long-term component availability.
- Power-Efficient DDR2 Architecture: The 1.7V to 1.9V operating voltage significantly reduces power dissipation compared to older DDR memory generations, lowering thermal management requirements.
- Industry-Standard Interface: Parallel DDR2 SDRAM interface ensures compatibility with a wide range of memory controllers and processors without requiring specialized hardware.
- Balanced Price-Performance: DDR2 technology offers a cost-effective solution for applications that do not require the bandwidth of newer memory generations while still providing substantial performance improvements over SDR SDRAM.
- Compact BGA Footprint: The 60-ball FBGA package in 8x10mm dimensions enables dense board layouts while maintaining adequate thermal dissipation characteristics.
Why Choose AS4C64M8D2-25BCN?
The AS4C64M8D2-25BCN represents a reliable memory solution for designs requiring proven DDR2 SDRAM technology. Alliance Memory's commitment to long-term product availability makes this device particularly attractive for industrial and embedded applications with extended production lifecycles.
Engineers seeking a balance between performance, power efficiency, and cost will find this 512Mbit DDR2 SDRAM well-suited for systems that need dependable memory without the complexity or expense of newer memory architectures. The active lifecycle status ensures continued supply for new designs and ongoing production.
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