AS4C64M8D2-25BINTR

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 628 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x10)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeIndustrial
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C64M8D2-25BINTR - 512Mbit DDR2 SDRAM

The AS4C64M8D2-25BINTR is a 512Mbit (64M x 8) DDR2 SDRAM from Alliance Memory, Inc., designed for high-performance embedded applications requiring reliable parallel memory access. Operating at 400MHz with 4ns access time, this DRAM delivers the speed and capacity needed for data-intensive systems while maintaining extended temperature tolerance from -40°C to 85°C. Its compact 60-FBGA package and industry-standard DDR2 interface make it suitable for space-constrained designs across industrial, communications, and computing platforms.

Key Features

  • Memory Architecture - 512Mbit capacity organized as 64M x 8, providing flexible memory addressing for various system designs.
  • DDR2 SDRAM Technology - Double data rate operation with 400MHz clock frequency and 4ns access time delivers efficient data throughput for demanding applications.
  • Parallel Interface - Standard parallel memory interface enables straightforward integration with existing processor and controller architectures.
  • Voltage Operation - 1.7V to 1.9V supply voltage range supports low-power system designs.
  • Extended Temperature Range - -40°C to 85°C operating temperature ensures reliable operation in industrial and harsh environments.
  • Compact Package - 60-TFBGA (8x10mm) footprint minimizes board space requirements while providing good thermal characteristics.

Typical Applications

  • Industrial Control Systems - This DDR2 SDRAM provides reliable program and data storage for PLCs, industrial PCs, and motion controllers where the extended temperature range ensures consistent operation in factory floor environments.
  • Networking Equipment - The 400MHz operation and parallel interface support packet buffering and routing table storage in switches, routers, and network appliances where fast memory access improves throughput.
  • Embedded Computing - The 512Mbit capacity and DDR2 interface serve as main memory or cache for embedded processors in medical devices, test equipment, and point-of-sale systems requiring reliable long-term availability.
  • Communications Infrastructure - This DRAM handles data buffering and protocol processing in telecom equipment, base stations, and gateway devices where extended temperature tolerance supports outdoor and cabinet installations.
  • Automotive Systems - The industrial temperature range makes this memory suitable for infotainment systems, instrument clusters, and telematics modules in vehicles where ambient temperatures vary widely.

Unique Advantages

  • Simplified BOM Management: Alliance Memory's focus on long-term product availability reduces the risk of costly redesigns and helps maintain consistent supply for multi-year production runs.
  • Design Flexibility: The 64M x 8 organization provides byte-wide access that simplifies memory controller design and enables efficient data handling in 8-bit and 16-bit processor systems.
  • Industrial Reliability: Extended temperature qualification from -40°C to 85°C eliminates the need for additional thermal management in many industrial applications, reducing system complexity and cost.
  • Proven DDR2 Technology: Mature DDR2 SDRAM architecture offers well-understood design characteristics and broad ecosystem support, reducing development risk and time-to-market.
  • Space-Efficient Integration: The compact 60-FBGA package delivers high capacity in a small footprint, enabling denser board layouts and supporting miniaturization efforts.
  • Cost-Effective Performance: The 400MHz clock frequency and 15ns write cycle time provide balanced performance for embedded applications without the premium pricing of higher-speed memory technologies.

Why Choose AS4C64M8D2-25BINTR?

The AS4C64M8D2-25BINTR delivers proven DDR2 SDRAM performance for designs requiring reliable parallel memory with extended temperature operation. Its 512Mbit capacity and industry-standard interface make it an ideal drop-in memory solution for industrial controllers, networking equipment, and embedded computing platforms. Alliance Memory's commitment to long-term product support ensures availability for multi-year production programs, reducing supply chain risks.

This DRAM is particularly well-suited for designs migrating from legacy memory technologies or requiring a stable, cost-effective memory solution with industrial temperature tolerance. The 60-FBGA package and 1.8V nominal operation support modern board design practices while maintaining compatibility with established DDR2 controller architectures.

Get Started

Contact our technical sales team to discuss your memory requirements and request pricing for the AS4C64M8D2-25BINTR. Our engineers can provide design support, reference layouts, and compatibility guidance to accelerate your product development.

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