AS4C64M8D3-12BIN

IC DRAM 512MBIT PARALLEL 78FBGA
Part Description

IC DRAM 512MBIT PARALLEL 78FBGA

Quantity 1,930 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package78-FBGA (8x10.5)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeAutomotive
Clock Frequency800 MHzVoltage1.425V ~ 1.575VMemory TypeVolatile
Operating Temperature-40°C ~ 95°C (TA)Write Cycle Time Word PageN/APackaging78-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C64M8D3-12BIN - 512Mbit DDR3 SDRAM

The AS4C64M8D3-12BIN from Alliance Memory is a 512Mbit DDR3 SDRAM organized as 64M x 8 bits. This parallel interface memory device operates at 800MHz clock frequency and is housed in a compact 78-FBGA package measuring 8x10.5mm.

Designed for industrial and embedded applications, this DRAM offers an extended operating temperature range of -40°C to 95°C, making it suitable for demanding environments where standard commercial-grade memory cannot perform reliably.

Key Features

  • Memory Architecture - 512Mbit density with 64M x 8 organization provides efficient data storage for embedded systems requiring byte-wide data access.
  • DDR3 SDRAM Technology - Delivers high-speed data transfer with 800MHz clock frequency and 20ns access time for responsive system performance.
  • Industrial Temperature Range - Operates reliably from -40°C to 95°C (TA), enabling deployment in harsh industrial and outdoor environments.
  • Low Voltage Operation - Functions within a 1.425V to 1.575V supply range, supporting energy-efficient system designs.
  • Compact Package - 78-VFBGA package in 8x10.5mm footprint enables high-density PCB layouts and space-constrained designs.
  • Parallel Interface - Standard parallel memory interface ensures straightforward integration with a wide range of processors and controllers.

Typical Applications

  • Industrial Automation Systems - This DDR3 SDRAM provides reliable memory for PLCs, HMIs, and industrial controllers where the extended temperature range ensures consistent operation in factory floor environments with varying thermal conditions.
  • Embedded Computing - The 64M x 8 organization and parallel interface make this device well-suited for single-board computers and embedded platforms requiring responsive data buffering and program execution.
  • Networking Equipment - Routers, switches, and communication gateways benefit from the 800MHz performance for packet buffering and routing table storage in enterprise and industrial network deployments.
  • Medical Devices - Portable and stationary medical equipment can leverage the industrial temperature rating and low voltage operation for reliable performance in clinical environments.
  • Test and Measurement - Data acquisition systems and instrumentation utilize this memory for sample buffering where consistent performance across temperature variations is essential for measurement accuracy.

Unique Advantages

  • Extended Temperature Reliability: The -40°C to 95°C operating range eliminates the need for additional thermal management in industrial applications, reducing system complexity and cost.
  • Drop-In Replacement: Industry-standard DDR3 pinout and timing specifications enable seamless integration into existing designs or migration from other DDR3 sources.
  • Long-Term Availability: Alliance Memory's focus on legacy and industrial memory products supports extended product lifecycles for designs requiring multi-year production runs.
  • Reduced BOM Complexity: Single-chip 512Mbit density consolidates memory requirements, simplifying PCB layout and reducing component count.
  • Active Product Status: Current production status ensures reliable supply chain access for both new designs and ongoing manufacturing needs.

Why Choose AS4C64M8D3-12BIN?

The AS4C64M8D3-12BIN is an ideal choice for engineers designing industrial and embedded systems that require high-density DDR3 memory with proven reliability across extreme temperature conditions. Its combination of 512Mbit capacity, 800MHz performance, and industrial temperature rating addresses the memory needs of applications where commercial-grade components fall short.

For designs requiring long product lifecycles and consistent supply, Alliance Memory's commitment to the industrial memory market provides confidence in component availability throughout your product's production lifetime.

Call to Action

Contact our sales team today to discuss your DDR3 SDRAM requirements, request volume pricing, or obtain samples of the AS4C64M8D3-12BIN for your evaluation and qualification process.

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