AS4C64M8D3L-12BIN

The AS4C64M8D3L-12BIN is a high-density 512Mbit DDR3 SDRAM from Alliance Memory, organized as 64M x 8 bits. This parallel interface memory device operates at 800MHz clock frequency and is designed for systems requiring reliable, high-bandwidth volatile memory storage.

With an extended operating temperature range of -40°C to 95°C, this SDRAM is well-suited for embedded applications in industrial and commercial environments where thermal resilience is essential.

Key Features

• High-Density Memory Architecture - 512Mbit capacity organized as 64M x 8 provides ample memory for data-intensive embedded applications while maintaining a compact footprint.
• DDR3 SDRAM Technology - Delivers high-bandwidth data transfer with 800MHz clock frequency and 20ns access time, enabling efficient system performance.
• Wide Operating Temperature Range - Rated for -40°C to 95°C operation, ensuring reliable performance across demanding thermal environments.
• Low Voltage Operation - Operates from 1.283V to 1.45V supply voltage, reducing power consumption compared to standard DDR3 implementations.
• Parallel Memory Interface - Standard parallel interface enables straightforward integration with a wide range of memory controllers and processors.
• Compact 78-FBGA Package - Space-efficient 8x10.5mm ball grid array package optimizes board layout in space-constrained designs.

Typical Applications

• Industrial Automation Systems - This DDR3 SDRAM provides reliable memory for PLCs, HMI displays, and motion controllers where the extended temperature range ensures consistent operation in factory floor environments.
• Embedded Computing Platforms - Single-board computers and embedded systems benefit from the 512Mbit density and 800MHz performance for running operating systems and applications.
• Networking and Communications Equipment - Routers, switches, and gateways utilize this memory for packet buffering and protocol processing where high bandwidth and thermal reliability are critical.
• Point-of-Sale Terminals - Retail and commercial transaction systems leverage the compact BGA package and extended temperature operation for deployment in varied retail environments.
• Medical Instrumentation - Diagnostic equipment and patient monitoring systems employ this SDRAM for data acquisition and processing where reliability across temperature variations is essential.

Unique Advantages

• Extended Temperature Operation: The -40°C to 95°C range eliminates the need for additional thermal management in many industrial designs, simplifying system architecture.
• Low Voltage DDR3L Compatibility: Operating at 1.283V to 1.45V reduces power consumption and heat generation, extending battery life in portable applications.
• Drop-in DDR3 Compatibility: Standard pinout and timing parameters enable straightforward second-sourcing and design migration from other DDR3 SDRAM suppliers.
• Compact BGA Footprint: The 78-FBGA package in 8x10.5mm dimensions maximizes board real estate utilization while providing excellent signal integrity.
• Active Lifecycle Status: Currently in active production, ensuring long-term availability for designs requiring extended product lifecycles.

Why Choose AS4C64M8D3L-12BIN?

The AS4C64M8D3L-12BIN represents an optimal balance of density, performance, and environmental resilience for embedded memory applications. Its 512Mbit capacity and 800MHz DDR3 interface deliver the bandwidth needed for modern embedded systems, while the extended industrial temperature range ensures operation in challenging environments.

For designers seeking a reliable, long-term memory solution with proven DDR3 technology, this Alliance Memory SDRAM offers the combination of performance specifications and environmental ratings demanded by industrial, commercial, and embedded applications.

Call to Action

Contact our sales team to discuss volume pricing and availability for the AS4C64M8D3L-12BIN. Our technical support engineers can assist with integration questions and provide samples for design evaluation.