AS4C64M8D3L-12BCNTR
| Part Description |
IC DRAM 512MBIT PARALLEL 78FBGA |
|---|---|
| Quantity | 1,953 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 78-FBGA (8x10.5) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Commercial (Extended) | ||
| Clock Frequency | 800 MHz | Voltage | 1.283V ~ 1.45V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 78-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C64M8D3L-12BCNTR - 512Mbit DDR3 SDRAM Memory IC
The AS4C64M8D3L-12BCNTR is a 512Mbit DDR3 SDRAM memory IC from Alliance Memory, Inc. Built on proven DDR3 SDRAM technology, this parallel interface memory device is organized as 64M x 8 and operates at 800MHz clock frequency. Designed for applications requiring reliable data storage and retrieval, this memory IC delivers 20ns access time performance in an extended temperature range of 0°C to 95°C, making it suitable for both commercial and industrial applications.
Key Features
- Memory Architecture - 512Mbit density organized as 64M x 8 provides flexible data width configuration for various system architectures.
- DDR3 SDRAM Technology - Delivers 800MHz clock frequency operation with 20ns access time for responsive data throughput in embedded systems.
- Operating Voltage - 1.283V to 1.45V supply voltage reduces power consumption compared to earlier DRAM generations while maintaining performance.
- Extended Temperature Range - 0°C to 95°C (TA) operating range supports deployment in industrial environments with elevated ambient temperatures.
- Compact Package - 78-VFBGA (8x10.5mm) form factor minimizes board space requirements in space-constrained designs.
- Parallel Interface - Standard parallel memory interface simplifies integration with existing processor and controller architectures.
Typical Applications
- Industrial Automation - This DDR3 SDRAM provides reliable memory for PLCs, motion controllers, and HMI systems where the extended temperature tolerance ensures consistent operation in factory floor environments subject to elevated temperatures.
- Networking Equipment - The 512Mbit density and parallel interface support packet buffering and routing table storage in switches and routers where fast access times improve data throughput.
- Embedded Computing Systems - Serves as main memory or cache in embedded processors running Linux, real-time operating systems, or bare-metal applications requiring volatile working memory with predictable performance.
- Test and Measurement Instruments - The DDR3 technology and extended temperature range make this memory suitable for oscilloscopes, spectrum analyzers, and data acquisition systems operating in lab and field environments.
- Medical Devices - Provides working memory for diagnostic equipment and patient monitoring systems where the extended temperature tolerance accommodates equipment that generates heat during operation.
Unique Advantages
- Proven Technology Platform: DDR3 SDRAM represents mature, well-characterized technology with extensive ecosystem support and driver availability across operating systems and processor families.
- Extended Temperature Capability: The 0°C to 95°C operating range eliminates the need for additional thermal management in many industrial applications, reducing system complexity and cost.
- Optimized Power Consumption: 1.283V to 1.45V supply voltage delivers lower power consumption than DDR2 while maintaining the performance required for embedded applications.
- Simplified BOM Management: The compact 78-VFBGA package reduces PCB footprint, allowing smaller board designs or freeing space for additional functionality.
- Active Lifecycle Status: Current production availability ensures long-term supply for products with multi-year lifecycles typical of industrial and embedded systems.
- Cost-Effective Density: 512Mbit capacity provides sufficient memory for many embedded applications without overprovisioning, optimizing system cost.
Why Choose AS4C64M8D3L-12BCNTR?
This DDR3 SDRAM from Alliance Memory offers a balanced combination of proven technology, extended temperature capability, and compact packaging for industrial and embedded applications. The 512Mbit density addresses the memory requirements of modern embedded processors and controllers without requiring multiple devices, simplifying board layout and reducing component count. With its 0°C to 95°C operating range, this memory IC eliminates thermal constraints that might otherwise require active cooling or limit deployment environments.
Design teams developing industrial controls, networking equipment, or embedded computing platforms will find this memory IC well-suited for applications requiring reliable volatile storage with predictable performance characteristics. The active lifecycle status and established DDR3 ecosystem support long product lifecycles and reduce integration risk.
Get Started
Contact our sales team to request pricing and availability for the AS4C64M8D3L-12BCNTR. Our technical support staff can assist with integration guidance, reference designs, and application-specific recommendations to help you optimize your design.
