AS4C64M8D3L-12BCN

IC DRAM 512MBIT PARALLEL 78FBGA
Part Description

IC DRAM 512MBIT PARALLEL 78FBGA

Quantity 1,234 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package78-FBGA (8x10.5)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeCommercial (Extended)
Clock Frequency800 MHzVoltage1.283V ~ 1.45VMemory TypeVolatile
Operating Temperature0°C ~ 95°C (TA)Write Cycle Time Word PageN/APackaging78-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C64M8D3L-12BCN - 512Mbit DDR3 SDRAM in 78-FBGA Package

The AS4C64M8D3L-12BCN is a high-performance 512Mbit DDR3 SDRAM from Alliance Memory, organized as 64M x 8 bits. This parallel interface memory device delivers 800MHz clock frequency operation with fast 20ns access time, making it suitable for demanding embedded applications requiring reliable volatile memory storage.

Housed in a compact 78-FBGA package measuring 8x10.5mm, this DDR3 SDRAM operates from a 1.283V to 1.45V supply voltage and supports an extended operating temperature range of 0°C to 95°C, enabling deployment in thermally challenging environments.

Key Features

  • Memory Architecture - 512Mbit capacity organized as 64M x 8, providing a byte-wide data path for efficient data transfers in embedded systems.
  • DDR3 SDRAM Technology - Double data rate architecture with 800MHz clock frequency delivers high bandwidth while maintaining compatibility with standard DDR3 memory controllers.
  • Fast Access Time - 20ns access time enables responsive memory operations critical for real-time processing applications.
  • Low Voltage Operation - 1.283V to 1.45V supply voltage range reduces power consumption compared to standard voltage DDR3 devices.
  • Extended Temperature Range - Operating range of 0°C to 95°C supports industrial and commercial applications with elevated thermal requirements.
  • Compact Package - 78-VFBGA package in 8x10.5mm footprint enables space-efficient board layouts while providing robust solder joint reliability.

Typical Applications

  • Industrial Control Systems - This DDR3 SDRAM provides reliable program and data storage for PLCs, motion controllers, and industrial computers where the extended temperature range ensures stable operation in factory floor environments.
  • Networking Equipment - The 800MHz clock frequency and byte-wide interface support packet buffering and routing table storage in switches, routers, and network appliances requiring consistent memory performance.
  • Embedded Computing - Single board computers and system-on-module designs benefit from the compact 78-FBGA footprint and low voltage operation, reducing overall system power budget.
  • Medical Devices - Diagnostic equipment and patient monitoring systems leverage the reliable DDR3 interface for data acquisition buffering and processing where consistent memory access timing is essential.

Unique Advantages

  • Pin and Function Compatible: Standard DDR3 SDRAM interface ensures drop-in compatibility with existing designs and widely available memory controllers.
  • Low Voltage DDR3L Operation: 1.283V to 1.45V supply reduces power dissipation and thermal load, simplifying thermal management in enclosed systems.
  • Wide Temperature Tolerance: 0°C to 95°C operating range eliminates the need for active cooling in many industrial installations.
  • Compact Form Factor: 78-FBGA package maximizes board space utilization while maintaining signal integrity for high-speed memory interfaces.
  • Active Lifecycle Status: Currently in active production, ensuring long-term availability for new designs and ongoing manufacturing programs.

Why Choose AS4C64M8D3L-12BCN?

The AS4C64M8D3L-12BCN delivers a compelling combination of DDR3 performance, low voltage operation, and extended temperature capability in a space-efficient package. Engineers designing embedded systems, industrial equipment, and networking products will find this device well-suited for applications demanding reliable high-bandwidth memory with proven DDR3 technology.

Alliance Memory's commitment to long product lifecycles and broad distribution ensures design continuity and supply chain stability for volume production requirements.

Get Started

Contact our sales team for pricing and availability on the AS4C64M8D3L-12BCN, or request a quote for your specific volume requirements. Technical support is available to assist with design integration and memory controller configuration.

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