AS4C64M8D3L-12BINTR
| Part Description |
IC DRAM 512MBIT PARALLEL 78FBGA |
|---|---|
| Quantity | 1,334 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 78-FBGA (8x10.5) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Automotive | ||
| Clock Frequency | 800 MHz | Voltage | 1.283V ~ 1.45V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 78-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C64M8D3L-12BINTR - 512Mbit DDR3 SDRAM
The AS4C64M8D3L-12BINTR is a 512Mbit DDR3 SDRAM memory device from Alliance Memory, Inc., organized as 64M x 8. This parallel interface DRAM delivers 800MHz clock frequency with 20ns access time, making it suitable for embedded systems and industrial applications requiring reliable, cost-effective volatile memory. With an extended temperature range of -40°C to 95°C, this device supports operation in demanding thermal environments.
Key Features
- Memory Configuration - 512Mbit capacity organized as 64M x 8, providing flexible data width options for various system architectures.
- DDR3 Technology - Leverages double data rate DDR3 SDRAM technology for improved bandwidth efficiency while maintaining industry-standard compatibility.
- Performance - 800MHz clock frequency and 20ns access time enable responsive data transfers for real-time applications.
- Power Efficiency - Operates on 1.283V to 1.45V supply voltage, reducing power consumption compared to earlier DDR generations.
- Extended Temperature Range - Rated for -40°C to 95°C ambient operation, supporting industrial and automotive-adjacent applications.
- Compact Package - 78-VFBGA (8x10.5mm) footprint minimizes board space requirements in space-constrained designs.
Typical Applications
- Industrial Automation - Provides main memory for PLCs, motor controllers, and industrial PCs where the extended temperature range ensures reliable operation in factory floor environments and the parallel interface simplifies integration with legacy control systems.
- Automotive Infotainment - Serves as frame buffer or working memory in dashboard displays and navigation systems where the -40°C to 95°C rating accommodates in-cabin temperature variations.
- Networking Equipment - Functions as packet buffer memory in routers, switches, and gateways where DDR3 bandwidth supports forwarding plane operations and the compact FBGA package conserves PCB real estate.
- Medical Devices - Supports embedded computing in diagnostic equipment and patient monitors where stable operation across temperature ranges ensures consistent performance in varied clinical settings.
- Point-of-Sale Systems - Acts as system memory in retail terminals and kiosks where reliable operation and moderate performance meet the needs of transaction processing and display rendering.
Unique Advantages
- Proven DDR3 Platform: Utilizes mature, widely-supported DDR3 technology that simplifies sourcing, design reuse, and long-term availability planning.
- Extended Industrial Temperature Tolerance: The -40°C to 95°C operating range reduces the need for additional thermal management components in industrial and harsh-environment applications.
- Reduced System Power Budget: 1.35V nominal operation lowers overall system power consumption and thermal output compared to DDR2, improving energy efficiency.
- Compact Footprint with High Density: 78-VFBGA package delivers 512Mbit capacity in just 8x10.5mm, enabling higher memory densities without expanding board dimensions.
- Parallel Interface Compatibility: Standard parallel memory interface integrates seamlessly with existing controller designs and FPGA memory interfaces without requiring specialized training or protocols.
- Active Lifecycle Status: Current production availability supports new designs and long-term projects with reduced obsolescence risk.
Why Choose AS4C64M8D3L-12BINTR?
The AS4C64M8D3L-12BINTR delivers a balanced combination of proven DDR3 technology, industrial-grade temperature performance, and compact packaging. Its 512Mbit density and x8 organization suit embedded applications where moderate memory capacity and straightforward parallel interfacing align with controller capabilities. For designs requiring operation beyond commercial temperature ranges, this device eliminates the need to specify more expensive wide-temperature alternatives while maintaining compatibility with standard DDR3 controllers and design practices.
Alliance Memory's focus on DRAM products for embedded and industrial markets provides continuity for designs with multi-year production horizons. The device's active lifecycle status and standard JEDEC-compatible footprint support design longevity and second-source options.
Get a Quote
Contact our sales team to discuss pricing, lead times, and volume availability for the AS4C64M8D3L-12BINTR. Our technical support staff can assist with design-in questions, reference designs, and application guidance.
