AS4C64M8D3-12BINTR

The AS4C64M8D3-12BINTR is a 512Mbit DDR3 SDRAM from Alliance Memory, Inc. Built on a 64M x 8 memory organization, this parallel interface DRAM delivers 800MHz clock frequency performance with 20ns access time. Engineered for industrial-grade applications, this device operates reliably across an extended temperature range of -40°C to 95°C, making it suitable for embedded systems, industrial controls, and networking equipment where temperature tolerance and data throughput are critical.

Key Features

• Memory Architecture: 512Mbit capacity organized as 64M x 8, providing flexible addressing for embedded applications requiring moderate density SDRAM.
• DDR3 Technology: Synchronous dynamic RAM utilizing DDR3 standard for improved bandwidth efficiency compared to DDR2, while maintaining lower power consumption than earlier generation memory technologies.
• High-Speed Operation: 800MHz clock frequency with 20ns access time supports data-intensive operations in networking, communications, and processing equipment.
• Extended Temperature Range: -40°C to 95°C (TA) operating temperature qualification enables deployment in industrial environments, outdoor installations, and automotive subsystems subject to temperature extremes.
• Compact Packaging: 78-VFBGA (8x10.5mm) package footprint conserves board space in space-constrained designs while providing reliable ball grid array connectivity.
• Voltage Supply: 1.425V to 1.575V operating range aligns with standard DDR3 voltage specifications for straightforward integration into existing DDR3 memory subsystems.

Typical Applications

• Industrial Automation: This SDRAM serves as working memory in programmable logic controllers (PLCs), human-machine interfaces (HMIs), and distributed control systems where the extended temperature specification ensures reliable operation in factory floor conditions.
• Networking Equipment: Routers, switches, and access points utilize this memory for packet buffering and routing table storage, where the 800MHz clock frequency supports wire-speed forwarding in multi-gigabit network infrastructure.
• Embedded Computing: Single-board computers and system-on-module platforms integrate this DDR3 SDRAM as main system memory, benefiting from the balance of density, speed, and industrial temperature tolerance for kiosks, digital signage, and edge computing nodes.
• Communications Infrastructure: Cellular base stations, wireless backhaul equipment, and telecommunications gear leverage this memory's performance and temperature range for reliable operation in outdoor cabinets and tower-mounted installations.
• Medical Devices: Diagnostic equipment and patient monitoring systems incorporate this SDRAM where stable operation across temperature variations and moderate memory bandwidth requirements align with device performance specifications.

Unique Advantages

• Industrial Temperature Tolerance: The -40°C to 95°C operating range eliminates the need for additional thermal management in many industrial applications, reducing system complexity and improving reliability in harsh environments.
• Proven DDR3 Ecosystem: Compatibility with standard DDR3 controllers and established design practices accelerates development and reduces integration risk compared to newer memory technologies requiring specialized support.
• Space-Efficient Footprint: The 78-VFBGA package's 8x10.5mm dimensions minimize PCB real estate consumption, enabling denser board layouts and supporting miniaturization efforts in embedded systems.
• Alliance Memory Reliability: Alliance Memory specializes in long-lifecycle memory products for industrial and embedded markets, providing continuity of supply and technical support for designs requiring extended product availability.
• Balanced Performance Profile: The 512Mbit density and 800MHz frequency provide sufficient performance for a wide range of embedded applications without the cost premium of higher-speed or higher-density alternatives.
• Straightforward Implementation: Parallel interface and standard DDR3 signaling allow designers to leverage existing DDR3 design expertise and reuse proven memory subsystem architectures across product lines.

Why Choose AS4C64M8D3-12BINTR?

The AS4C64M8D3-12BINTR is positioned for embedded and industrial designs requiring reliable DDR3 SDRAM with extended temperature capability. Engineers developing equipment for factory automation, outdoor networking, telecommunications infrastructure, or ruggedized computing benefit from the combination of industrial-grade temperature qualification, standard DDR3 interface, and compact BGA packaging. This device is particularly suited for designs transitioning from legacy SDRAM to DDR3 or seeking a stable, long-lifecycle memory solution from a supplier focused on the industrial and embedded markets.

For applications where temperature tolerance, supply continuity, and proven technology matter more than cutting-edge density or speed, the AS4C64M8D3-12BINTR delivers dependable performance without unnecessary complexity. The device supports cost-effective bill of materials optimization in moderate-volume production while maintaining technical margins for reliable operation across environmental extremes.

Contact Us for Pricing and Availability

Request a quote for the AS4C64M8D3-12BINTR or contact our technical sales team to discuss your memory requirements, volume pricing, and lead times. Our application engineers are available to assist with design integration, reference schematics, and technical specifications to accelerate your development timeline.