AS4C64M8D3-12BCNTR
| Part Description |
IC DRAM 512MBIT PARALLEL 78FBGA |
|---|---|
| Quantity | 548 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 78-FBGA (8x10.5) | Memory Format | DRAM | Technology | SDRAM - DDR3 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 20 ns | Grade | Commercial (Extended) | ||
| Clock Frequency | 800 MHz | Voltage | 1.425V ~ 1.575V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 78-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C64M8D3-12BCNTR - 512Mbit DDR3 SDRAM
The AS4C64M8D3-12BCNTR is a 512-megabit DDR3 SDRAM organized as 64M x 8, delivering high-performance memory for embedded systems and computing applications. With an 800 MHz clock frequency and 20ns access time, this volatile memory provides the speed and reliability required for data-intensive operations. Operating from 1.425V to 1.575V with an extended temperature range of 0°C to 95°C, this DRAM is well-suited for industrial and commercial applications requiring dependable performance.
Key Features
- High-Speed DDR3 Architecture - 800 MHz clock frequency with 20ns access time enables fast data throughput for demanding applications requiring rapid memory operations.
- 512Mbit Capacity (64M x 8 Organization) - Provides ample memory space in a compact 78-VFBGA package, allowing for efficient board layout and reduced PCB footprint.
- Extended Temperature Range - Operates reliably from 0°C to 95°C (TA), making it suitable for industrial environments and applications exposed to temperature variations.
- Low Voltage Operation - 1.425V to 1.575V supply voltage reduces power consumption compared to older memory technologies, supporting energy-efficient designs.
- Parallel Interface - Standard parallel memory interface simplifies integration with a wide range of processors, FPGAs, and embedded controllers.
- Compact FBGA Package - 78-VFBGA package (8mm x 10.5mm) provides a small form factor ideal for space-constrained designs.
Typical Applications
- Industrial Automation - This DDR3 SDRAM provides high-speed memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs where the extended temperature range ensures reliable operation in factory floor environments.
- Embedded Computing Systems - The 512Mbit capacity and parallel interface make this DRAM ideal for embedded processors and microcontrollers in networking equipment, point-of-sale terminals, and data acquisition systems requiring fast, volatile memory.
- Consumer Electronics - With its compact FBGA package and low voltage operation, this memory supports set-top boxes, digital displays, and multimedia devices where board space and power efficiency are critical design considerations.
- Communications Equipment - The 800 MHz clock frequency and 20ns access time enable rapid data buffering in routers, switches, and base station controllers where high-speed memory access is essential for maintaining throughput.
- Test and Measurement Instruments - This SDRAM provides the memory bandwidth needed for oscilloscopes, spectrum analyzers, and data loggers that must capture and process high-speed signals while operating across varying environmental conditions.
Unique Advantages
- Proven DDR3 Technology: Leverages mature, widely-supported DDR3 architecture that simplifies sourcing, reduces design risk, and ensures long-term compatibility with existing platforms.
- Temperature Resilience: 0°C to 95°C operating range extends deployment options beyond standard commercial-grade components, reducing the need for thermal management in many industrial applications.
- Space-Efficient Design: Compact 78-VFBGA footprint (8mm x 10.5mm) minimizes PCB area requirements, enabling smaller product form factors or freeing board space for additional features.
- Energy-Conscious Operation: Lower supply voltage compared to DDR2 reduces power consumption and heat generation, improving system efficiency and potentially lowering cooling requirements.
- Flexible Integration: Standard parallel interface and industry-standard pinout facilitate straightforward integration with diverse processor architectures and FPGA families without complex interface logic.
- Active Lifecycle Status: Current production availability supports new designs and long-term product roadmaps with confidence in component availability.
Why Choose the AS4C64M8D3-12BCNTR?
For engineers designing embedded systems, industrial controls, or communications equipment, the AS4C64M8D3-12BCNTR offers a balanced combination of performance, capacity, and environmental tolerance. The extended temperature range makes it particularly valuable for industrial applications where standard commercial memory may not provide adequate margins, while the compact package and low voltage operation support modern, space-constrained, energy-efficient designs.
With proven DDR3 technology and active lifecycle status, this SDRAM is an excellent choice for both new product development and upgrades to existing platforms. Its 800 MHz operation and 20ns access time deliver the performance needed for real-time processing, buffering, and data handling, while the 512Mbit density provides sufficient memory for a wide range of embedded applications without over-provisioning.
Get a Quote
Contact our sales team to discuss pricing, availability, and technical support for the AS4C64M8D3-12BCNTR. Our component specialists can help you evaluate whether this DDR3 SDRAM meets your performance requirements and assist with volume pricing for production builds.