AS4C64M8D3-12BCN

IC DRAM 512MBIT PARALLEL 78FBGA
Part Description

IC DRAM 512MBIT PARALLEL 78FBGA

Quantity 1,226 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package78-FBGA (8x10.5)Memory FormatDRAMTechnologySDRAM - DDR3
Memory Size512 MbitAccess Time20 nsGradeCommercial (Extended)
Clock Frequency800 MHzVoltage1.425V ~ 1.575VMemory TypeVolatile
Operating Temperature0°C ~ 95°C (TA)Write Cycle Time Word PageN/APackaging78-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C64M8D3-12BCN - 512Mbit DDR3 SDRAM

The AS4C64M8D3-12BCN from Alliance Memory is a 512Mbit DDR3 SDRAM designed for high-performance embedded and computing applications. With a 64M x 8 memory organization and 800MHz clock frequency, this parallel interface DRAM delivers reliable data storage and retrieval in commercial-grade temperature environments. Built on DDR3 technology, it provides an optimal balance of speed, power efficiency, and cost-effectiveness for designs requiring volatile memory solutions.

Key Features

  • Memory Core: 512Mbit capacity organized as 64M x 8, providing flexible addressing for diverse application requirements.
  • DDR3 Technology: Double data rate architecture with 800MHz clock frequency enables high-bandwidth data transfers while maintaining power efficiency.
  • Fast Access: 20ns access time ensures rapid read and write operations for time-sensitive applications.
  • Power Supply: Operates on 1.425V to 1.575V supply voltage, consistent with DDR3 standards for lower power consumption compared to earlier DRAM generations.
  • Parallel Interface: Traditional parallel memory interface simplifies integration with legacy systems and microcontrollers that support parallel DRAM connections.
  • Extended Temperature Range: Operates reliably across 0°C to 95°C ambient temperature range, suitable for commercial and light industrial applications.
  • Compact Package: 78-VFBGA (8mm x 10.5mm) footprint maximizes board space efficiency in space-constrained designs.

Typical Applications

  • Embedded Computing Systems: This DDR3 SDRAM serves as main memory in single-board computers and embedded processors where the 800MHz clock frequency and parallel interface provide sufficient bandwidth for control and data processing tasks.
  • Industrial Controllers: The 0°C to 95°C operating range makes this memory suitable for programmable logic controllers and industrial HMI systems that require stable memory operation in temperature-variable factory environments.
  • Network Equipment: Routers, switches, and network appliances utilize this SDRAM for packet buffering and routing table storage where the 512Mbit capacity balances cost with adequate buffer memory.
  • Consumer Electronics: Set-top boxes, digital displays, and multimedia devices leverage this volatile memory for real-time data handling and display buffering in cost-sensitive consumer products.
  • Telecommunications: VoIP systems and telecom infrastructure equipment benefit from the reliable parallel interface and commercial-grade temperature tolerance for voice and data processing applications.

Unique Advantages

  • Proven DDR3 Technology: Leverages mature DDR3 standard for predictable performance and broad ecosystem support, reducing design risk and validation time.
  • Cost-Effective Capacity: 512Mbit density hits a sweet spot for applications that need more than legacy SDRAM but don't require gigabit-scale memory, optimizing BOM costs.
  • Simplified Integration: Parallel interface eliminates the complexity of high-speed serial memory protocols, enabling faster development cycles for teams familiar with traditional DRAM architectures.
  • Extended Temperature Tolerance: 95°C upper limit exceeds standard commercial specs, providing margin for designs in semi-enclosed or passively-cooled enclosures.
  • Board Space Efficiency: Compact 78-FBGA package reduces PCB footprint compared to larger memory packages, enabling denser board layouts.
  • Active Lifecycle Status: Current production availability ensures long-term supply for new designs and ongoing production runs.

Why Choose AS4C64M8D3-12BCN?

The AS4C64M8D3-12BCN is engineered for designs that require reliable, cost-effective volatile memory with proven DDR3 technology. Its 800MHz operation and 20ns access time deliver sufficient performance for embedded controllers, network equipment, and consumer electronics without the complexity or cost of newer memory technologies. The extended commercial temperature range and compact FBGA packaging make it particularly suitable for space-constrained industrial and networking applications.

For engineers seeking a dependable memory solution with broad compatibility and long-term availability, the AS4C64M8D3-12BCN from Alliance Memory offers a practical balance of performance, reliability, and value.

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Contact our sales team to discuss pricing, availability, and technical support for the AS4C64M8D3-12BCN. We provide detailed datasheets, reference designs, and application guidance to accelerate your development cycle.

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