AS4C64M8D2-25BIN

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 276 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x10)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time400 psGradeIndustrial
Clock Frequency400 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C64M8D2-25BIN - 512Mbit DDR2 SDRAM with Industrial Temperature Range

The AS4C64M8D2-25BIN is a high-performance 512Mbit DDR2 SDRAM from Alliance Memory organized as 64M x 8 bits. This parallel-interface memory device operates at a 400MHz clock frequency and delivers 0.4ns access time, providing the bandwidth needed for demanding embedded applications.

Designed with an extended operating temperature range of -40°C to 85°C, this DDR2 SDRAM is well-suited for industrial environments where temperature stability is essential. The device is housed in a compact 60-TFBGA package with a 1.7V to 1.9V supply voltage, balancing performance with power efficiency.

Key Features

  • Memory Configuration - 512Mbit capacity organized as 64M x 8 bits, providing ample storage for system code, data buffers, and runtime memory requirements.
  • High-Speed DDR2 Interface - 400MHz clock frequency with 0.4ns access time enables high-bandwidth data transfers through the parallel memory interface.
  • Industrial Temperature Support - Operates reliably across -40°C to 85°C temperature range, meeting the demands of industrial and harsh environment applications.
  • Low Voltage Operation - 1.7V to 1.9V supply voltage reduces power consumption compared to standard voltage DDR2 devices.
  • Compact Package - 60-TFBGA (8x10mm) package enables space-efficient PCB designs while maintaining thermal performance.
  • Write Cycle Time - 15ns write cycle time per word/page supports efficient memory write operations.

Typical Applications

  • Industrial Automation - This DDR2 SDRAM provides reliable memory for PLCs, HMIs, and industrial controllers where the -40°C to 85°C operating range ensures consistent performance in factory floor environments with temperature fluctuations.
  • Embedded Computing Systems - The 64M x 8 organization and parallel interface make this device suitable for embedded processors requiring high-bandwidth volatile memory for system operation and data processing.
  • Networking Equipment - Industrial-grade networking devices such as managed switches and routers benefit from the extended temperature range and 400MHz clock speed for packet buffering and routing table storage.
  • Transportation Systems - Railway signaling, traffic control systems, and fleet management equipment can leverage the robust temperature specifications for reliable operation in outdoor and vehicle-mounted installations.
  • Building Automation - HVAC controllers, security systems, and building management platforms benefit from the compact 60-FBGA footprint and industrial temperature rating for distributed installations.

Unique Advantages

  • Extended Product Lifecycle: Alliance Memory specializes in long-term availability, helping reduce redesign costs and qualification cycles for products with multi-year production runs.
  • Industry-Standard Footprint: The 60-FBGA (8x10mm) package follows standard DDR2 pinouts, simplifying drop-in replacement and second-source strategies.
  • Full Industrial Temperature Range: The -40°C to 85°C specification eliminates the need for thermal management solutions in many industrial designs, reducing BOM cost and complexity.
  • Optimized Power Efficiency: The 1.7V to 1.9V supply voltage range enables lower power consumption and reduced thermal dissipation in space-constrained designs.
  • Active Lifecycle Status: This device is currently in active production, ensuring reliable supply for ongoing and new design projects.

Why Choose AS4C64M8D2-25BIN?

The AS4C64M8D2-25BIN is an excellent choice for engineers designing industrial embedded systems that require high-performance DDR2 memory with guaranteed operation across harsh environmental conditions. The combination of 512Mbit density, 400MHz clock speed, and full industrial temperature support makes it a versatile solution for applications ranging from factory automation to transportation infrastructure.

Alliance Memory's commitment to long-term product availability means designers can confidently specify this device for products with extended lifecycle requirements. The standard DDR2 interface and footprint ensure compatibility with existing chipsets while the industrial-grade specifications provide the reliability needed for mission-critical systems.

Request Information

Contact our sales team for pricing, availability, and technical support for the AS4C64M8D2-25BIN DDR2 SDRAM. Our applications engineers can assist with design integration and help identify the optimal memory solution for your specific requirements.

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