AS4C64M8D1-5BIN

IC DRAM 512MBIT PARALLEL 60FBGA
Part Description

IC DRAM 512MBIT PARALLEL 60FBGA

Quantity 1,908 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of AS4C64M8D1-5BIN - 512Mbit DDR SDRAM

The AS4C64M8D1-5BIN from Alliance Memory is a 512Mbit DDR SDRAM organized as 64M x 8 bits. This high-performance volatile memory device operates at 200MHz clock frequency with a fast 0.7ns access time, making it suitable for demanding embedded applications requiring reliable data storage and rapid access.

Designed for industrial-grade applications, this DDR SDRAM operates across an extended temperature range of -40°C to 85°C and features a low-voltage supply range of 2.3V to 2.7V for flexible system integration.

Key Features

  • Memory Configuration - 512Mbit capacity organized as 64M x 8 bits provides substantial data storage in a compact footprint for embedded systems.
  • High-Speed Performance - 200MHz clock frequency and 0.7ns access time deliver rapid data throughput for time-critical applications.
  • Extended Temperature Operation - Full industrial temperature range of -40°C to 85°C ensures reliable operation in harsh environmental conditions.
  • Low-Voltage Operation - 2.3V to 2.7V supply voltage range supports power-efficient designs and compatibility with various system architectures.
  • Compact Package - 60-TFBGA (8x13mm) package enables space-constrained PCB layouts while maintaining excellent thermal characteristics.
  • Parallel Interface - Standard parallel memory interface provides straightforward integration with existing memory controllers and system designs.

Typical Applications

  • Industrial Automation - This DDR SDRAM provides reliable data buffering for PLCs, HMI systems, and industrial controllers where the extended -40°C to 85°C temperature range ensures consistent operation in factory floor environments.
  • Telecommunications Equipment - The 200MHz clock speed and 512Mbit capacity support high-bandwidth data processing in networking equipment, routers, and communication infrastructure requiring sustained memory performance.
  • Embedded Computing - Low-voltage 2.3V to 2.7V operation and compact 60-TFBGA package make this SDRAM ideal for space-constrained embedded systems including single-board computers and IoT gateways.
  • Medical Devices - Industrial temperature rating and reliable DDR architecture support portable diagnostic equipment and patient monitoring systems that must operate across varying environmental conditions.

Unique Advantages

  • Active Lifecycle Status: Currently in production with ongoing availability for long-term project planning and volume procurement.
  • Alliance Memory Quality: Manufactured by Alliance Memory with established supply chain reliability for consistent component sourcing.
  • Pin-Compatible Design: Standard DDR SDRAM pinout simplifies drop-in replacement and second-source qualification in existing designs.
  • Wide Voltage Tolerance: 2.3V to 2.7V operating range accommodates supply variation and enables integration across diverse power architectures.
  • Industrial Temperature Grade: -40°C to 85°C rating eliminates the need for thermal management systems in many industrial applications.

Why Choose AS4C64M8D1-5BIN?

The AS4C64M8D1-5BIN represents a reliable DDR SDRAM solution for designers requiring industrial-grade memory performance. With its combination of 512Mbit density, 200MHz operation, and extended temperature range, this device addresses the needs of embedded systems that demand both high performance and environmental resilience.

Engineers developing industrial automation, telecommunications, and embedded computing platforms will benefit from the straightforward parallel interface, compact 60-TFBGA package, and active production status that ensures long-term component availability.

Call to Action

Contact our sales team to discuss volume pricing and lead times for the AS4C64M8D1-5BIN. Our technical support staff can assist with design integration questions and provide samples for evaluation.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up