AS4C64M4SA-7TCN

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 850 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.5 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C64M4SA-7TCN - 256Mbit SDRAM in 54-TSOP II Package

The AS4C64M4SA-7TCN is a 256Mbit Synchronous DRAM (SDRAM) from Alliance Memory, organized as 64M x 4 bits. This parallel interface memory device operates at clock frequencies up to 143MHz with a fast 5.5ns access time, making it suitable for applications requiring high-bandwidth volatile memory storage.

Housed in a 54-pin TSOP II package with 10.16mm width, this SDRAM operates from a 3V to 3.6V supply voltage and supports commercial temperature range operation from 0°C to 70°C.

Key Features

  • Memory Architecture - 256Mbit density organized as 64M x 4, providing flexible memory addressing for embedded system designs.
  • High-Speed Operation - 143MHz clock frequency with 5.5ns access time enables high-bandwidth data transfers for demanding applications.
  • Parallel Interface - Standard parallel memory interface ensures broad compatibility with existing memory controllers and processor designs.
  • Low Voltage Operation - 3V to 3.6V supply voltage range reduces power consumption compared to 5V alternatives.
  • Commercial Temperature Range - Specified operation from 0°C to 70°C covers standard commercial and office environment requirements.
  • Industry-Standard Package - 54-TSOP II (10.16mm width) footprint allows drop-in replacement compatibility with other manufacturers.

Typical Applications

  • Networking Equipment - This SDRAM provides packet buffering and routing table storage in switches, routers, and network interface cards where the 143MHz clock speed supports wire-rate data processing.
  • Consumer Electronics - Set-top boxes, digital media players, and display systems benefit from the 256Mbit density for frame buffering and application code execution within commercial temperature environments.
  • Office Automation - Printers, copiers, and multifunction devices utilize this memory for print spooling and image processing where the parallel interface simplifies integration with existing controller designs.
  • Embedded Computing - Single-board computers and embedded modules leverage the 64M x 4 organization for efficient memory utilization in space-constrained designs using the compact TSOP II package.

Unique Advantages

  • Proven SDRAM Technology: Mature, well-characterized memory technology reduces design risk and simplifies firmware development with established timing parameters.
  • Second-Source Availability: Alliance Memory provides supply chain continuity as an alternative source for standard SDRAM configurations.
  • Compact Form Factor: The 54-TSOP II package offers high density in a surface-mount footprint suitable for automated assembly processes.
  • Broad Voltage Tolerance: The 3V to 3.6V operating range accommodates typical 3.3V system voltage variations without requiring tight regulation.
  • Active Lifecycle Status: Currently in active production status, supporting both new designs and long-term product maintenance requirements.

Why Choose AS4C64M4SA-7TCN?

The AS4C64M4SA-7TCN delivers a balanced combination of density, speed, and compatibility for designs requiring proven SDRAM performance. With 256Mbit capacity and 143MHz operation, this device addresses mainstream embedded memory requirements without over-specifying performance or capacity.

Engineers designing commercial-grade equipment will appreciate the straightforward integration path offered by the standard parallel interface and industry-compatible TSOP II package. The active production status from Alliance Memory ensures long-term availability for volume production and product lifecycle support.

Contact Us

Request a quote today to discuss pricing and availability for your volume requirements. Our sales team can provide technical support and help identify the optimal memory solution for your specific application needs.

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