AS4C64M4SA-6TIN
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 236 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 4 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of AS4C64M4SA-6TIN - 256Mbit SDRAM in Industrial Temperature Range
The AS4C64M4SA-6TIN is a 256Mbit synchronous dynamic random access memory (SDRAM) from Alliance Memory, Inc. This parallel interface DRAM provides reliable volatile memory storage in a 64M x 4 organization. Designed for industrial applications, it operates across an extended temperature range of -40°C to 85°C, making it ideal for embedded systems requiring dependable memory performance in challenging environments.
Key Features
- Memory Architecture - 256Mbit capacity organized as 64M x 4, providing flexible data width configuration for various system designs.
- SDRAM Technology - Synchronous operation with 166MHz clock frequency and 5.5ns access time enables fast data throughput for time-critical applications.
- Power Supply - Operates on standard 3V to 3.6V supply voltage, compatible with common embedded system power rails.
- Industrial Temperature Range - Qualified for -40°C to 85°C ambient temperature operation, ensuring reliable performance in harsh industrial environments.
- Package - 54-pin TSOP II package with 10.16mm width provides space-efficient PCB footprint for compact designs.
- Parallel Interface - Direct parallel memory interface simplifies integration with microcontrollers and processors supporting standard SDRAM protocols.
Typical Applications
- Industrial Automation - This SDRAM provides reliable memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where extended temperature tolerance ensures consistent operation in factory floor environments subject to temperature variations.
- Embedded Computing - Serves as main system memory in embedded computers and single-board computers operating in industrial settings, providing the volatile memory needed for OS and application execution.
- Instrumentation and Test Equipment - Supports data buffering and processing in measurement and test systems that must maintain accuracy across wide temperature ranges in laboratory or field deployment.
- Communication Infrastructure - Functions as buffer memory in routers, switches, and telecommunications equipment deployed in outdoor cabinets or uncontrolled environments where industrial temperature ratings are essential.
- Automotive Electronics - Provides memory for automotive infotainment, telematics, and control systems requiring extended temperature operation, though not automotive-grade qualified.
Unique Advantages
- Extended Temperature Reliability: Industrial temperature qualification reduces system failures in harsh environments, lowering warranty costs and improving customer satisfaction.
- Standard SDRAM Interface: Direct compatibility with established memory controllers eliminates the need for special driver development, accelerating time to market.
- Proven DRAM Technology: Mature synchronous DRAM architecture delivers predictable performance characteristics for simplified system validation.
- Active Lifecycle Status: Current production availability ensures long-term supply security for multi-year product programs.
- Compact Footprint: TSOP II package enables higher memory density per board area compared to through-hole solutions.
- 166MHz Operation: Clock frequency supports bandwidth requirements of industrial processors and DSPs without overclocking or timing margin concerns.
Why Choose AS4C64M4SA-6TIN?
The AS4C64M4SA-6TIN delivers essential memory capacity for industrial embedded systems where temperature extremes are a design constraint. Its combination of standard SDRAM interface, industrial temperature rating, and active production status makes it suitable for designs requiring proven technology with long-term availability. Engineers selecting this component benefit from Alliance Memory's focus on industrial and embedded memory solutions.
For applications demanding reliable volatile memory in industrial temperature ranges, the AS4C64M4SA-6TIN provides a balanced solution between capacity, performance, and environmental tolerance.
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Contact our sales team for pricing, availability, and technical support for the AS4C64M4SA-6TIN. Our application engineers can assist with integration guidance and alternative part recommendations to match your specific system requirements.
