AS4C64M4SA-6TINTR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 1,908 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 4
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C64M4SA-6TINTR - 256Mbit Synchronous DRAM

The AS4C64M4SA-6TINTR is a 256Mbit synchronous dynamic RAM from Alliance Memory, Inc., organized as 64M x 4 bits and built on proven SDRAM technology. Designed for embedded systems and industrial applications requiring reliable parallel memory, this device operates at clock frequencies up to 166MHz with a fast 5ns access time. It delivers dependable performance across an extended temperature range while maintaining compatibility with standard 3.3V power supplies.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 64M x 4, providing flexible word width for x4 data bus implementations common in embedded controllers and communication systems.
  • Performance - 166MHz clock frequency operation with 5ns access time enables fast data throughput for applications requiring responsive memory subsystems.
  • Power and Voltage - Standard 3.3V supply voltage (3V to 3.6V range) simplifies integration with existing 3.3V logic families and reduces power conversion complexity.
  • Industrial Temperature Range - Operates reliably from -40°C to 85°C, making it suitable for industrial equipment, automotive peripherals, and outdoor installations where temperature extremes are common.
  • Package - Available in 54-pin TSOP II package with 10.16mm width, offering a compact footprint for space-constrained PCB designs.

Typical Applications

  • Industrial Automation - Provides working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and motion control systems where extended temperature tolerance ensures consistent operation in factory floor environments.
  • Embedded Computing - Serves as main memory in microprocessor-based systems, single-board computers, and communication processors where parallel SDRAM interfaces are standard and 256Mbit capacity meets system requirements.
  • Networking Equipment - Functions as packet buffer memory in switches, routers, and network interface cards where synchronous operation aligns with system timing and parallel access supports high-bandwidth data paths.
  • Test and Measurement Instruments - Enables data acquisition and waveform storage in oscilloscopes, logic analyzers, and automated test equipment where industrial temperature rating supports benchtop and field deployment.
  • Medical Devices - Supports imaging systems, patient monitors, and diagnostic equipment requiring stable memory performance across varying ambient conditions in clinical settings.

Unique Advantages

  • Proven SDRAM Technology: Leverages mature synchronous DRAM architecture with broad ecosystem support, simplifying hardware design and software driver development.
  • Parallel Interface Compatibility: Direct connection to microprocessors and controllers with parallel memory buses eliminates protocol conversion overhead and reduces system latency.
  • Extended Temperature Operation: Industrial temperature range reduces need for active cooling or environmental controls in demanding installations, lowering system cost and complexity.
  • Standard Voltage Operation: 3.3V supply voltage aligns with common embedded system power rails, avoiding need for additional voltage regulators and simplifying power distribution.
  • Compact TSOP II Packaging: Space-efficient form factor enables higher memory density on PCBs while maintaining manufacturability for standard SMT assembly processes.
  • Active Lifecycle Status: Ongoing availability from Alliance Memory supports long product lifecycles typical of industrial and embedded applications, reducing redesign risk.

Why Choose AS4C64M4SA-6TINTR?

The AS4C64M4SA-6TINTR addresses the needs of industrial and embedded system designers who require dependable parallel SDRAM with extended environmental specifications. Its 256Mbit capacity balances memory size with cost-effectiveness for mid-range applications, while 166MHz operation and 5ns access time deliver sufficient performance for real-time control, data acquisition, and communication tasks. The device's industrial temperature rating and active lifecycle status make it particularly well-suited for equipment expected to operate for years in challenging environments.

By offering standard SDRAM functionality in an industrial-grade package, this component enables designers to leverage established memory architectures while meeting the durability and reliability requirements of professional equipment markets.

Get a Quote

Contact our sales team to discuss your memory requirements, request pricing for the AS4C64M4SA-6TINTR, or explore alternative Alliance Memory solutions for your application. Our technical support staff can assist with integration questions and provide additional documentation to support your design process.

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