AS4C8M16S-7BCNTR
| Part Description |
IC DRAM 128MBIT PAR 54TFBGA |
|---|---|
| Quantity | 888 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C8M16S-7BCNTR - 128Mbit SDRAM in Compact 54-TFBGA Package
The AS4C8M16S-7BCNTR is a 128-megabit synchronous dynamic random-access memory (SDRAM) from Alliance Memory, Inc. Organized as 8M x 16, this parallel-interface DRAM provides reliable volatile memory storage for embedded systems requiring moderate density and proven technology. Operating from a 3V to 3.6V supply, this device offers 5.4ns access time and 143MHz clock frequency in a space-saving 8mm x 8mm 54-TFBGA package.
Designed for commercial temperature applications ranging from 0°C to 70°C, this SDRAM delivers dependable performance for cost-sensitive designs where established memory technology and straightforward integration are priorities.
Key Features
- 128Mbit Density - 8M x 16 organization provides sufficient memory capacity for embedded applications, control systems, and data buffering tasks without overprovisioning.
- SDRAM Technology - Synchronous operation with 143MHz clock frequency and 5.4ns access time delivers predictable performance for real-time and time-sensitive applications.
- Parallel Interface - Direct memory bus connection simplifies integration with microcontrollers, DSPs, and FPGAs supporting traditional parallel DRAM interfaces.
- Compact 54-TFBGA Package - 8mm x 8mm footprint (54-ball Thin Fine-pitch Ball Grid Array) conserves board space in size-constrained designs.
- 3V to 3.6V Operation - Standard logic voltage compatibility reduces power requirements and simplifies power supply design.
- Commercial Temperature Range - Rated for 0°C to 70°C ambient operation, suitable for indoor and climate-controlled environments.
Typical Applications
- Embedded Computing - This SDRAM serves as main system memory or frame buffer in single-board computers and embedded modules where 128Mbit capacity meets application requirements without excess cost.
- Consumer Electronics - Provides working memory for set-top boxes, media players, and appliances requiring moderate-density volatile storage with proven reliability.
- Networking Equipment - Functions as packet buffer or lookup table memory in switches and routers operating in controlled environments, where the commercial temperature rating aligns with typical deployment conditions.
- Test and Measurement Instruments - Offers data acquisition buffering and waveform storage for benchtop and laboratory instruments that benefit from the compact TFBGA package and straightforward parallel interface.
- Legacy System Support - Enables repairs and sustained production for established designs built around parallel SDRAM architecture, maintaining compatibility with existing hardware platforms.
Unique Advantages
- Proven Technology with Established Supply: SDRAM architecture offers mature ecosystem support with readily available design resources and reference implementations that accelerate development.
- Simplified PCB Layout: Parallel interface eliminates high-speed serial signal integrity challenges, reducing layer count requirements and layout complexity compared to newer memory types.
- Cost-Effective Density: 128Mbit capacity targets applications where this specific memory size optimizes bill-of-materials cost without paying for unused higher densities.
- Direct Processor Integration: Native parallel DRAM controller support in many microcontrollers and processors enables straightforward interfacing without external bridge chips or protocol converters.
- Low Voltage Operation: 3V to 3.6V supply voltage aligns with standard digital logic levels, minimizing power consumption and thermal management requirements.
- Space-Efficient Package: 54-TFBGA format delivers higher density than equivalent TSOP packages while maintaining compatibility with standard PCB manufacturing and assembly processes.
Why Choose AS4C8M16S-7BCNTR?
The AS4C8M16S-7BCNTR addresses designs requiring established SDRAM technology in a compact form factor for commercial applications. Its 8M x 16 organization and parallel interface make it well-suited for embedded systems, consumer products, and instrumentation where proven memory architecture reduces integration risk and development time. The 54-TFBGA package provides board space savings while maintaining compatibility with standard assembly processes.
This device is an appropriate choice for cost-sensitive commercial designs operating in controlled environments, legacy platform support, and applications prioritizing straightforward integration over cutting-edge performance specifications.
Get a Quote Today
Contact our sales team to discuss your specific memory requirements and receive detailed pricing for the AS4C8M16S-7BCNTR. Our technical support can assist with integration guidance, reference designs, and volume availability to ensure your project timeline and budget objectives are met.