AS4C8M16S-7BCNTR

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 888 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page2 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C8M16S-7BCNTR - 128Mbit SDRAM in Compact 54-TFBGA Package

The AS4C8M16S-7BCNTR is a 128-megabit synchronous dynamic random-access memory (SDRAM) from Alliance Memory, Inc. Organized as 8M x 16, this parallel-interface DRAM provides reliable volatile memory storage for embedded systems requiring moderate density and proven technology. Operating from a 3V to 3.6V supply, this device offers 5.4ns access time and 143MHz clock frequency in a space-saving 8mm x 8mm 54-TFBGA package.

Designed for commercial temperature applications ranging from 0°C to 70°C, this SDRAM delivers dependable performance for cost-sensitive designs where established memory technology and straightforward integration are priorities.

Key Features

  • 128Mbit Density - 8M x 16 organization provides sufficient memory capacity for embedded applications, control systems, and data buffering tasks without overprovisioning.
  • SDRAM Technology - Synchronous operation with 143MHz clock frequency and 5.4ns access time delivers predictable performance for real-time and time-sensitive applications.
  • Parallel Interface - Direct memory bus connection simplifies integration with microcontrollers, DSPs, and FPGAs supporting traditional parallel DRAM interfaces.
  • Compact 54-TFBGA Package - 8mm x 8mm footprint (54-ball Thin Fine-pitch Ball Grid Array) conserves board space in size-constrained designs.
  • 3V to 3.6V Operation - Standard logic voltage compatibility reduces power requirements and simplifies power supply design.
  • Commercial Temperature Range - Rated for 0°C to 70°C ambient operation, suitable for indoor and climate-controlled environments.

Typical Applications

  • Embedded Computing - This SDRAM serves as main system memory or frame buffer in single-board computers and embedded modules where 128Mbit capacity meets application requirements without excess cost.
  • Consumer Electronics - Provides working memory for set-top boxes, media players, and appliances requiring moderate-density volatile storage with proven reliability.
  • Networking Equipment - Functions as packet buffer or lookup table memory in switches and routers operating in controlled environments, where the commercial temperature rating aligns with typical deployment conditions.
  • Test and Measurement Instruments - Offers data acquisition buffering and waveform storage for benchtop and laboratory instruments that benefit from the compact TFBGA package and straightforward parallel interface.
  • Legacy System Support - Enables repairs and sustained production for established designs built around parallel SDRAM architecture, maintaining compatibility with existing hardware platforms.

Unique Advantages

  • Proven Technology with Established Supply: SDRAM architecture offers mature ecosystem support with readily available design resources and reference implementations that accelerate development.
  • Simplified PCB Layout: Parallel interface eliminates high-speed serial signal integrity challenges, reducing layer count requirements and layout complexity compared to newer memory types.
  • Cost-Effective Density: 128Mbit capacity targets applications where this specific memory size optimizes bill-of-materials cost without paying for unused higher densities.
  • Direct Processor Integration: Native parallel DRAM controller support in many microcontrollers and processors enables straightforward interfacing without external bridge chips or protocol converters.
  • Low Voltage Operation: 3V to 3.6V supply voltage aligns with standard digital logic levels, minimizing power consumption and thermal management requirements.
  • Space-Efficient Package: 54-TFBGA format delivers higher density than equivalent TSOP packages while maintaining compatibility with standard PCB manufacturing and assembly processes.

Why Choose AS4C8M16S-7BCNTR?

The AS4C8M16S-7BCNTR addresses designs requiring established SDRAM technology in a compact form factor for commercial applications. Its 8M x 16 organization and parallel interface make it well-suited for embedded systems, consumer products, and instrumentation where proven memory architecture reduces integration risk and development time. The 54-TFBGA package provides board space savings while maintaining compatibility with standard assembly processes.

This device is an appropriate choice for cost-sensitive commercial designs operating in controlled environments, legacy platform support, and applications prioritizing straightforward integration over cutting-edge performance specifications.

Get a Quote Today

Contact our sales team to discuss your specific memory requirements and receive detailed pricing for the AS4C8M16S-7BCNTR. Our technical support can assist with integration guidance, reference designs, and volume availability to ensure your project timeline and budget objectives are met.

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