H5TQ4G83EFR-TEI

The H5TQ4G83EFR-TEI sits at the top of SK Hynix's 4Gb DDR3 family, carrying the -TE speed grade that runs DDR3-2133 with 14-14-14 timing and a 0.935ns clock period. It holds 4,294,967,296 bits arranged as 512M x 8 across eight internal banks, and the -I suffix qualifies the part over the full -40°C to 95°C industrial temperature range. Address and command inputs latch on the clock edges while data, strobes, and masks are sampled on both edges through an 8-bit prefetch data path, all from a single 1.5V rail.

Key Features

• DDR3-2133 speed grade - the -TE bin specifies tAA of 13.09ns and a 0.935ns average clock period, with programmable CAS latency up to 14 for high-bandwidth transfers.
• 512M x 8 organization - four gigabits split across eight banks with a 1KB page size, well matched to bandwidth-hungry x8 memory arrays.
• Single 1.5V supply - VDD and VDDQ both operate at 1.5V plus or minus 0.075V, with VDDQ tracking VDD to simplify the power design.
• Signal integrity toolkit - dynamic on-die termination, ZQ calibration, an on-chip DLL, and write leveling keep the channel clean at 2133 MT/s; differential DQS strobes and selectable driver strength are standard.
• Industrial temperature handling - full operation from -40°C to 95°C, with the refresh interval halved to 3.9us between 85°C and 95°C to protect data retention.
• 78-ball FBGA - a compact fine-pitch package with asynchronous RESET and optional TDQS on the x8 configuration.

Typical Applications

• Networking and telecom line cards - the DDR3-2133 grade feeds packet buffers and lookup tables where sustained throughput matters.
• Industrial edge systems - the -40°C to 95°C rating suits factory controllers and gateways exposed to wide ambient swings.
• Embedded compute and imaging - eight-bank interleaving and 8-bit prefetch support frame buffering and signal-processing workloads.

Unique Advantages

• Top-bin headroom - because -TE is the fastest grade in this 4Gb family, a design can down-bin to slower DDR3 rates while keeping one validated part.
• Retention-aware refresh - the specified 7.8us interval at 0°C to 85°C and 3.9us above it gives thermal designers a clear rule for hot enclosures.
• Drop-in x8 footprint - the JEDEC 78-ball FBGA aligns with common DDR3 x8 layouts, easing board reuse across memory revisions.

Why Choose H5TQ4G83EFR-TEI?

Buyers pick the H5TQ4G83EFR-TEI when they need the fastest 4Gb DDR3 x8 grade in a fully specified industrial-temperature part. Note that SK Hynix lists this device as end-of-life, so it is best suited to sustaining existing production or last-time-buy programs rather than fresh designs that could target a currently active grade.

Contact our team for current pricing, stock, and lead time on the H5TQ4G83EFR-TEI, and ask about last-time-buy quantities to keep your production line supplied.