EMD56164PCH-60x

The EMD56164PCH-60x is a 256 Mbit volatile memory device implemented in mobile LPDDR SDRAM technology. It delivers a x16 data organization in a compact 60‑ball FBGA (8 × 9 mm) package and is intended for space‑constrained, high‑performance embedded applications that require low‑voltage operation and extended temperature capability.

With a nominal clock frequency of 166 MHz, a 5 ns access time and a 1.7–1.95 V supply range, this LPDDR memory balances speed and power efficiency while providing surface‑mount assembly compatibility and RoHS compliance for production hardware.

Key Features

• Core / Memory: 256 Mbit memory size with x16 memory organization for wide data paths and efficient word transfers.
• Technology & Interface: Mobile LPDDR SDRAM technology and LPDDR interface optimized for low‑voltage, high‑throughput embedded designs.
• Performance: 166 MHz clock frequency and 5 ns access time support responsive memory access for real‑time and interactive applications.
• Power: 1.7–1.95 V supply voltage range targets low‑voltage system designs and helps reduce overall power consumption.
• Package & Mounting: 60‑FBGA package (60‑BGA, 8 × 9 mm) with surface‑mount mounting type for compact board layouts and automated assembly.
• Temperature & Grade: Extended operating temperature range from −30 °C to +85 °C, suitable for extended‑environment electronics.
• Compliance: RoHS‑compliant construction for regulatory and environmental requirements.
• Power Management & System Features: Series documentation references advanced memory features such as power‑down and deep power‑down modes, partial array self‑refresh and programmable output drive strength for flexible power/performance tradeoffs.

Typical Applications

• Mobile and Handheld Devices: Compact FBGA package and LPDDR interface make the device suitable for space‑limited mobile platforms and handheld electronics.
• Embedded Computing: Provides low‑voltage, high‑speed memory for embedded processors and system‑on‑module designs requiring a x16 memory bus.
• Industrial Electronics: Extended temperature grade supports industrial control and instrumentation systems that operate outside commercial temperature ranges.
• Connected Devices & IoT: Small footprint and low supply voltage suit battery‑sensitive connected devices and sensor gateways.

Unique Advantages

• Wide Data Path (x16): Enables efficient 16‑bit transfers that simplify memory interface design and reduce controller overhead.
• Compact, Production‑Ready Package: 60‑FBGA (8 × 9 mm) provides a small board footprint compatible with surface‑mount assembly processes.
• Low‑Voltage Operation: 1.7–1.95 V supply range supports lower system power budgets while maintaining performance at 166 MHz.
• Extended Temperature Support: −30 °C to +85 °C operating range improves reliability for electronics deployed in challenging thermal environments.
• Regulatory Alignment: RoHS compliance simplifies environmental assurance and supply‑chain acceptance.
• Flexible Power Modes: Series‑level features such as power‑down and deep power‑down modes enable designers to tune standby and active power for battery‑sensitive systems.

Why Choose EMD56164PCH-60x?

The EMD56164PCH-60x offers a practical combination of capacity, performance and compact packaging for designers building mobile, embedded and industrial products. Its LPDDR implementation, wide x16 bus and low‑voltage operation make it well suited for systems that require responsive memory access without sacrificing board space or power efficiency.

Choose this device when you need a RoHS‑compliant, surface‑mount LPDDR memory with extended temperature capability and proven series‑level memory features to help balance performance and power in production hardware.

Request a quote for EMD56164PCH-60x or submit a purchase inquiry to obtain pricing, availability and volume options for your design cycle.