EMD28164PCH-60x
| Part Description |
128Mb Mobile LPDDR SDRAM, x16, 60‑FBGA |
|---|---|
| Quantity | 1,462 Available (as of June 16, 2026) |
| Product Category | DRAM Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 60-BGA (8x9mm) | Memory Format | RAM | Technology | SDRAM - Mobile LPDDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5 ns | Grade | Extended | ||
| Clock Frequency | 166 MHz | Voltage | 1.7~1.95V | Memory Type | Volatile | ||
| Operating Temperature | -30°C - 85°C | Mounting Method | Surface Mount | Memory Interface | LPDDR | ||
| Memory Organization | x16 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | ECCN | EAR99 | HTS Code | 8542.32.00.02 |
Overview of EMD28164PCH-60x – 128Mb Mobile LPDDR SDRAM, x16, 60‑FBGA
The EMD28164PCH-60x is a 128 Mbit mobile LPDDR SDRAM organized as x16 and implemented in a 60-ball FBGA (8 × 9 mm) surface-mount package. It uses a double data rate architecture to deliver two data words per clock cycle, providing efficient high-bandwidth memory access for compact systems.
Designed for low-voltage operation (VDD/VDDQ 1.7–1.95 V) and extended temperature operation from −30 °C to +85 °C, this device targets mobile and embedded applications that require a small footprint, low-power features, and flexible performance options.
Key Features
- Core & Memory Architecture 128 Mbit DDR SDRAM organized as 4 banks (x16 organization) with a 2n-prefetch double data rate design to transfer two data words per clock cycle.
- Performance 166 MHz clock frequency option with DDR output timing; CAS latencies selectable (CL = 2 and 3) and programmable burst lengths (2, 4, 8, 16) and burst types (sequential or interleave) for flexible throughput and latency trade-offs.
- Power and Low‑Power Modes Low-voltage operation (1.7–1.95 V) plus Power Down and Deep Power Down modes, Partial Array Self-Refresh (PASR) and Auto Temperature Compensated Self-Refresh (ATCSR) to reduce energy consumption in battery-powered designs.
- Interfaces & Signaling LPDDR interface with differential clock inputs (CK/CK), bidirectional data strobe (DQS), data mask (DM) support and LVCMOS-compatible control signals to simplify integration.
- System Features Four internal banks for concurrent operation, programmable output buffer drive strength, Auto Precharge option per burst, and Clock Stop capability for idle periods to optimize system behavior.
- Package & Temperature 60-FBGA (60-BGA, 8 × 9 mm) surface-mount package rated for Extended grade operation from −30 °C to +85 °C.
Typical Applications
- Mobile and Handheld Devices — Compact LPDDR form factor and low-voltage operation make it suitable for memory in space-constrained mobile designs.
- Battery‑Powered Electronics — Power-down modes, PASR and ATCSR help extend battery life in portable systems.
- Embedded and Industrial Modules — Extended temperature range (−30 °C to +85 °C) supports deployment in industrial and rugged embedded applications.
Unique Advantages
- Low‑voltage operation: 1.7–1.95 V supply simplifies power-rail design for modern LPDDR systems.
- Flexible performance tuning: Programmable CAS latency, burst length and burst type let designers balance latency and throughput for target workloads.
- Compact, surface‑mount package: 60-FBGA (8 × 9 mm) package enables high-density board layouts in small form-factor products.
- Power management features: PASR, ATCSR, Power Down and Deep Power Down modes reduce standby current and extend operational life in portable applications.
- Robust system integration: Differential clocking, DQS and data mask support ensure reliable high-speed data capture and write masking on x16 data paths.
Why Choose EMD28164PCH-60x?
The EMD28164PCH-60x positions itself as a compact, low-voltage LPDDR memory choice for designs that need a 128 Mbit x16 device with programmable performance and comprehensive low-power features. Its 60-ball FBGA package and extended temperature rating make it well suited for space-constrained and industrially oriented embedded systems.
With DDR architecture, selectable latencies and multiple refresh/self-refresh options, this device offers designers the configuration flexibility needed to optimize system throughput, power and reliability while keeping board area and power-rail complexity to a minimum.
Request a quote or submit an RFQ to get pricing and availability for the EMD28164PCH-60x and include your desired order quantity and delivery requirements.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH