EMD56164PBH-60x

The EMD56164PBH-60x is a 256 Mbit volatile memory device implemented as mobile LPDDR SDRAM with a x16 data organization. It provides a compact, surface-mount memory solution in a 60‑ball FBGA (60‑BGA, 8×9 mm) package for space-constrained designs.

Designed for systems that require low-voltage operation and extended temperature capability, this device operates at a supply range of 1.7–1.95 V, supports a 166 MHz clock frequency, and is specified for operation from −30 °C to 85 °C.

Key Features

• Memory Core 256 Mbit mobile LPDDR SDRAM; volatile memory organized as x16 for 16‑bit data transfers.
• Performance 166 MHz clock frequency and 5 ns access time provide deterministic timing for embedded memory tasks.
• Low‑Voltage Operation VDD/VDDQ range of 1.7–1.95 V supports low-power system designs requiring reduced supply voltages.
• Package and Mounting 60‑FBGA (60‑BGA, 8×9 mm) surface‑mount package optimizes board area and mechanical profile for compact assemblies.
• Extended Temperature Grade Rated for −30 °C to +85 °C operation to meet thermal requirements in extended‑temperature embedded applications.
• Standards and Compliance RoHS compliant for environmental and regulatory conformity in modern assemblies.

Typical Applications

• Mobile and Handheld Devices Compact LPDDR storage for memory buffering and working memory in small, battery‑sensitive products.
• Embedded Systems Onboard system memory for microcontroller or application processor platforms that require a 16‑bit memory interface.
• Consumer Electronics Memory for compact appliances and devices where board space, low voltage, and extended temperature capability matter.

Unique Advantages

• Compact FBGA Footprint: 60‑ball BGA (8×9 mm) reduces PCB area and simplifies placement in densely populated boards.
• Low‑Voltage Compatibility: 1.7–1.95 V supply range enables integration into low‑power rails common in mobile and embedded systems.
• Extended Temperature Range: Specified −30 °C to +85 °C for reliable operation across a wide range of environmental conditions.
• Deterministic Timing: 5 ns access time and 166 MHz clock frequency provide known timing characteristics for system memory design.
• RoHS Compliant: Meets environmental compliance requirements for modern electronic products.
• Surface‑Mount Ready: Standard SMD package supports high‑volume manufacturing and automated assembly processes.

Why Choose EMD56164PBH-60x?

The EMD56164PBH-60x delivers a clear balance of density, low‑voltage operation, and compact packaging for designs that require mobile LPDDR memory in a small footprint. Its x16 organization and defined timing characteristics simplify memory interface design for embedded and handheld applications.

With extended temperature support and RoHS compliance, this device is positioned for durable, manufacturable deployments where board space and power budget are constrained. It is suitable for engineering teams seeking a straightforward LPDDR memory option with predictable electrical and thermal characteristics.

Request a quote or submit an inquiry to check availability, pricing, and lead time for the EMD56164PBH-60x. Our team can provide ordering details and support for integration into your design.