JSD12164PA

The JSD12164PA is a 512 Mbit volatile memory device implemented as a Mobile LPDDR SDRAM die with a x16 memory organization. It provides a compact die-level memory solution characterized by a 200 MHz clock frequency and a 5 ns access time for memory subsystems requiring LPDDR interface compatibility.

Designed for extended-grade operation, this die supports a supply voltage range of 1.7–1.95 V and an operating temperature range of −30 °C to 85 °C, making it suitable for systems that require reliable memory performance across a wide temperature band.

Key Features

• Core / Memory: 512 Mbit capacity organized as x16, implemented as SDRAM with Mobile LPDDR technology for LPDDR interface designs.
• Performance: 200 MHz clock frequency with a 5 ns access time to support responsive memory access patterns.
• Power: 1.7–1.95 V supply voltage range to match systems designed around LPDDR power domains.
• Package & Mounting: Supplied as a die; mounting type listed as surface mount for integration into custom packages or module assembly processes.
• Temperature & Grade: Extended-grade device rated for −30 °C to 85 °C operating temperature.
• Compliance: RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Mobile devices: Memory integration in mobile and portable device subsystems that use LPDDR interfaces and require die-level packaging.
• Embedded systems: On-board memory for embedded designs that demand a x16 LPDDR memory organization and extended temperature support.
• Custom memory modules and modules-in-package: Die format suitable for module integrators building compact memory assemblies or stacked packages.

Unique Advantages

• Die-level integration: Delivered as a die to enable custom packaging and tight system integration for compact or space-constrained designs.
• LPDDR interface compatibility: Mobile LPDDR SDRAM technology and LPDDR interface support simplify integration into LPDDR-based memory subsystems.
• Balanced performance: 200 MHz clock and 5 ns access time provide a balance of frequency and access responsiveness for many embedded memory tasks.
• Extended operating range: −30 °C to 85 °C rating ensures operation across a broad temperature spectrum for industrial or temperature-variable environments.
• Flexible voltage window: 1.7–1.95 V supply range accommodates designs targeting LPDDR voltage domains.
• RoHS compliant: Meets lead-free assembly requirements for regulated production environments.

Why Choose JSD12164PA?

JSD12164PA positions itself as a compact, die-level Mobile LPDDR SDRAM option for designs that require a 512 Mbit memory footprint with x16 organization. Its combination of 200 MHz clocking, 5 ns access time, extended temperature rating, and a defined supply voltage range supports reliable integration into LPDDR-based memory subsystems.

The part is suited to engineers and integrators building custom modules, compact systems, or embedded platforms that require die-level memory components and RoHS-compliant parts. Its specifications support long-term design stability where consistent operating temperature range and LPDDR interface compatibility are required.

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