JSD12324PA

The JSD12324PA is a 512 Mbit volatile memory device implemented as Mobile LPDDR SDRAM. It delivers x32 organization and an LPDDR memory interface tailored for designs that require compact, high-density volatile memory.

With a 200 MHz clock frequency, 5 ns access time rating and a 1.7–1.95 V supply range, this die-form LPDDR component targets applications where low-voltage LPDDR memory integration and extended temperature operation are important.

Key Features

• Core / Memory 512 Mbit memory capacity organized as x32, implemented using Mobile LPDDR SDRAM technology.
• Interface LPDDR memory interface for mobile SDRAM integration.
• Performance 200 MHz clock frequency with a specified access time of 5 ns for predictable memory access characteristics.
• Power Low-voltage operation with a supply range of 1.7–1.95 V, supporting LPDDR system power domains.
• Package & Mounting Supplied as a die with surface mount mounting type information provided for board-level integration planning.
• Temperature & Grade Extended-grade device rated for operation from −30 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Mobile and handheld devices — Integration where Mobile LPDDR SDRAM is required for volatile working memory.
• Memory die integration — Use in custom modules or multi-die assemblies that incorporate LPDDR die-level components.
• Low-voltage memory subsystems — Designs targeting 1.7–1.95 V power domains and LPDDR interfaces.

Unique Advantages

• Compact die form factor: Die-level supply enables custom integration into high-density memory assemblies and space-constrained designs.
• LPDDR compatibility: Mobile LPDDR SDRAM technology and LPDDR interface simplify integration into LPDDR memory subsystems.
• Low-voltage operation: 1.7–1.95 V supply range supports modern low-power system architectures.
• Deterministic access performance: 200 MHz clock frequency and 5 ns access time provide clear parameters for memory timing and system design.
• Extended temperature rating: −30 °C to 85 °C operation supports deployment in environments requiring broader thermal range.
• Regulatory compliance: RoHS compliance supports assembly and manufacturing environmental requirements.

Why Choose JSD12324PA?

JSD12324PA positions itself as a compact, die-form Mobile LPDDR SDRAM solution offering 512 Mbit capacity with x32 organization and LPDDR interface compatibility. Its combination of low-voltage operation, defined timing characteristics, and extended temperature grade makes it suitable for designs that require LPDDR memory integrated at the die level.

This part is a fit for teams building memory-dense, low-voltage subsystems where predictable access timing, compact integration, and adherence to RoHS are required. The specification set supports scalable designs that rely on LPDDR memory technology and extended-temperature operation.

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