JSMC04AUM1ASAEA-H5I

The JSMC04AUM1ASAEA-H5I is a 4GB (32 Gbit) non-volatile NAND flash memory device presented as a single‑stack eMMC 5.1 solution. It implements MLC NAND technology with an eMMC 5.1 memory interface and supports HS400 signaling as described in the product documentation.

Designed and specified for industrial applications, the device operates from a 3.3V supply, runs with a 200 MHz clock capability, and is qualified for surface‑mount installation in a 153‑FBGA package (153‑BGA, 11.5 × 13.0 mm) with an operating temperature range of -40 °C to 85 °C.

Key Features

• Memory Architecture  4GB (32 Gbit) NAND flash organized as a single eMMC 5.1 stack using MLC FLASH technology for embedded mass storage.
• Interface & Timing  eMMC 5.1 interface with HS400 support as documented; device timing and HS400 bus specifications are provided in the datasheet.
• Clock & Supply  Specified for operation with a 200 MHz clock frequency and a 3.3V supply.
• Industrial Grade  Rated for an operating temperature range of -40 °C to 85 °C suitable for industrial environments.
• Package & Mounting  Surface mount 153‑FBGA package (153‑BGA, 11.5 × 13.0 × 1.0 mm) optimized for compact embedded designs.
• Device Management & Security  Datasheet references partition management (boot area and RPMB), secure delete features (Sanitize, Secure Erase, Secure Trim), packed commands, and device health reporting.
• Firmware & Power Management  Supports Field Firmware Upgrade (FFU) and auto power saving modes as documented for in-field maintainability and lower idle power.
• Standards Compliance  RoHS compliant as stated in product environmental information.

Typical Applications

• Industrial Embedded Storage  Reliable non‑volatile storage for industrial controllers, gateways, and equipment that require extended temperature range and surface‑mount integration.
• Boot and System Firmware Storage  Boot area partitioning and documented boot operation make the device suitable for storing bootloaders and firmware images.
• Secure Data and Authentication  RPMB partitioning and secure erase/sanitize capabilities support secure keying, authentication data, and tamper‑resistant storage.
• Field‑Upgradeable Systems  Field Firmware Upgrade (FFU) support enables in‑field firmware updates for long‑lifecycle industrial products.

Unique Advantages

• Industrial Temperature Range: Designed for -40 °C to 85 °C operation, providing suitability for temperature‑challenging deployments.
• Compact Surface‑Mount Package: The 153‑FBGA (11.5 × 13.0 mm) package conserves board area while enabling high‑density embedded designs.
• eMMC 5.1 with HS400 Support: Modern eMMC 5.1 interface and HS400 capability (per datasheet) provide a documented, high‑performance embedded memory interface.
• Partition and Security Features: Boot area and RPMB partition management plus secure delete options allow designers to separate system and secure data reliably.
• Field Maintainability: Field Firmware Upgrade and cache management features assist with firmware updates and in‑service maintenance.
• Regulatory Compliance: RoHS compliance addresses environmental and materials requirements for manufacturing and procurement.

Why Choose JSMC04AUM1ASAEA-H5I?

The JSMC04AUM1ASAEA-H5I positions itself as a compact, industrial‑grade embedded storage device that combines eMMC 5.1 interface features with MLC NAND FLASH in a single‑stack 4GB configuration. Its documented HS400 interface, partition management, secure erase capabilities, and field firmware upgrade support make it suitable for industrial systems requiring reliable boot/storage management and secure data handling.

Engineers specifying this device benefit from clear package dimensions and surface‑mount readiness, an extended temperature rating, and RoHS compliance—factors that support long‑lifecycle designs and streamlined integration into industrial embedded platforms.

Request a quote or submit an inquiry to receive pricing, availability, and support for evaluation samples and production quantities of the JSMC04AUM1ASAEA-H5I. Our team can assist with technical details and procurement next steps.