JSMC08AUM1ASAEA-H5
| Part Description |
8GB eMMC 5.1 1-stack |
|---|---|
| Quantity | 888 Available (as of June 17, 2026) |
| Product Category | eMMC Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 153-BGA (11.5x13mm) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C - 85°C | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | N/A | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of JSMC08AUM1ASAEA-H5 – 8GB eMMC 5.1 1-stack
The JSMC08AUM1ASAEA-H5 is an 8GB (64 Gbit) eMMC 5.1 embedded storage device based on NAND (MLC) flash technology. It provides on-board non-volatile flash storage in a 153-ball BGA surface-mount package (11.5×13.0×1.0 mm) for commercial-grade embedded applications.
Designed for systems requiring eMMC 5.1 functionality, the device supports HS400 interface timing and a 200 MHz clock frequency, and includes features documented in the product datasheet such as boot area and RPMB partitions, field firmware upgrade, secure delete modes, and power-saving options.
Key Features
- Memory Capacity & Technology 64 Gbit (8GB) of non-volatile NAND flash (MLC) provided in an eMMC 5.1 memory format.
- Interface & Performance eMMC 5.1 interface with HS400 bus timing support and a 200 MHz clock frequency as specified in the datasheet.
- Boot & Partition Management Boot area partition and RPMB area partition support plus extended CSD-based partition management (details in datasheet).
- Field Firmware Upgrade (FFU) Supports field firmware upgrade procedures as documented in the technical notes.
- Data Management & Security Secure Delete capabilities including Sanitize, Secure Erase and Secure Trim are supported per the datasheet.
- System Integration Features Cache support, Packed Commands, High Priority Interrupt (HPI) handling and device health reporting are included.
- Power & Voltage Single-supply operation at 3.3 V and Auto Power Saving Mode behavior documented in the datasheet.
- Package & Mounting 153-FBGA (153-BGA) surface-mount package, 11.5×13.0×1.0 mm footprint for compact board-level integration.
- Operating Range & Grade Commercial grade device with an operating temperature range of −25 °C to 85 °C and RoHS compliance.
Typical Applications
- Embedded systems (boot storage) Boot-capable eMMC storage using the boot area partition and documented boot operation sequences.
- Commercial embedded devices On-board non-volatile storage for commercial-grade products requiring surface-mount BGA integration and a −25 °C to 85 °C operating range.
- Field-upgradeable systems Systems that require Field Firmware Upgrade (FFU) support and in-field firmware maintenance as described in the technical notes.
- Secure storage applications Use cases requiring secure erase, sanitize, or secure trim capabilities and replay-protected memory partitioning (RPMB).
Unique Advantages
- Standardized eMMC 5.1 interface Facilitates integration with controllers and hosts that support the eMMC 5.1 specification, including HS400 timing.
- Boot and RPMB partition support Enables dedicated boot storage and secure replay-protected partitions for authentication and secure data handling.
- Field firmware upgrade capability Supports in-field firmware updates (FFU) to streamline maintenance and firmware rollouts.
- Comprehensive data management features Includes cache management, packed commands, device health reporting, and multiple secure delete methods for robust storage control.
- Compact, board-ready package 153-ball BGA (11.5×13.0 mm) surface-mount package simplifies BOM and mechanical integration for compact designs.
- Commercial temperature and RoHS compliant Operates across a −25 °C to 85 °C range and is RoHS compliant for regulatory alignment in commercial products.
Why Choose JSMC08AUM1ASAEA-H5?
The JSMC08AUM1ASAEA-H5 combines a standardized eMMC 5.1 interface with NAND MLC flash capacity and documented HS400 timing to provide a straightforward embedded storage option for commercial designs. Its on-device partition management, secure delete modes, FFU support and system-oriented features such as HPI and device health reporting make it suitable for designs that need integrated boot capability and controlled storage management.
Packaged in a 153-BGA surface-mount footprint and operating from a 3.3 V supply across a −25 °C to 85 °C range, this part is positioned for compact, board-level integration where verifiable eMMC 5.1 behavior and developer-focused datasheet guidance are required.
Request a quote or submit an inquiry to receive pricing, availability and the full technical documentation for the JSMC08AUM1ASAEA-H5.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH