JSMC08AUM1ASAEA-H5

8GB eMMC 5.1 1-stack
Part Description

8GB eMMC 5.1 1-stack

Quantity 888 Available (as of June 17, 2026)
Product CategoryeMMC Memory
ManufacturerJeju Semiconductor Corporation
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package153-BGA (11.5x13mm)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency200 MHzVoltage3.3VMemory TypeNon-Volatile
Operating Temperature-25°C - 85°CMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory OrganizationN/AMoisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownECCNEAR99HTS Code8542.32.00.71

Overview of JSMC08AUM1ASAEA-H5 – 8GB eMMC 5.1 1-stack

The JSMC08AUM1ASAEA-H5 is an 8GB (64 Gbit) eMMC 5.1 embedded storage device based on NAND (MLC) flash technology. It provides on-board non-volatile flash storage in a 153-ball BGA surface-mount package (11.5×13.0×1.0 mm) for commercial-grade embedded applications.

Designed for systems requiring eMMC 5.1 functionality, the device supports HS400 interface timing and a 200 MHz clock frequency, and includes features documented in the product datasheet such as boot area and RPMB partitions, field firmware upgrade, secure delete modes, and power-saving options.

Key Features

  • Memory Capacity & Technology  64 Gbit (8GB) of non-volatile NAND flash (MLC) provided in an eMMC 5.1 memory format.
  • Interface & Performance  eMMC 5.1 interface with HS400 bus timing support and a 200 MHz clock frequency as specified in the datasheet.
  • Boot & Partition Management  Boot area partition and RPMB area partition support plus extended CSD-based partition management (details in datasheet).
  • Field Firmware Upgrade (FFU)  Supports field firmware upgrade procedures as documented in the technical notes.
  • Data Management & Security  Secure Delete capabilities including Sanitize, Secure Erase and Secure Trim are supported per the datasheet.
  • System Integration Features  Cache support, Packed Commands, High Priority Interrupt (HPI) handling and device health reporting are included.
  • Power & Voltage  Single-supply operation at 3.3 V and Auto Power Saving Mode behavior documented in the datasheet.
  • Package & Mounting  153-FBGA (153-BGA) surface-mount package, 11.5×13.0×1.0 mm footprint for compact board-level integration.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of −25 °C to 85 °C and RoHS compliance.

Typical Applications

  • Embedded systems (boot storage)  Boot-capable eMMC storage using the boot area partition and documented boot operation sequences.
  • Commercial embedded devices  On-board non-volatile storage for commercial-grade products requiring surface-mount BGA integration and a −25 °C to 85 °C operating range.
  • Field-upgradeable systems  Systems that require Field Firmware Upgrade (FFU) support and in-field firmware maintenance as described in the technical notes.
  • Secure storage applications  Use cases requiring secure erase, sanitize, or secure trim capabilities and replay-protected memory partitioning (RPMB).

Unique Advantages

  • Standardized eMMC 5.1 interface  Facilitates integration with controllers and hosts that support the eMMC 5.1 specification, including HS400 timing.
  • Boot and RPMB partition support  Enables dedicated boot storage and secure replay-protected partitions for authentication and secure data handling.
  • Field firmware upgrade capability  Supports in-field firmware updates (FFU) to streamline maintenance and firmware rollouts.
  • Comprehensive data management features  Includes cache management, packed commands, device health reporting, and multiple secure delete methods for robust storage control.
  • Compact, board-ready package  153-ball BGA (11.5×13.0 mm) surface-mount package simplifies BOM and mechanical integration for compact designs.
  • Commercial temperature and RoHS compliant  Operates across a −25 °C to 85 °C range and is RoHS compliant for regulatory alignment in commercial products.

Why Choose JSMC08AUM1ASAEA-H5?

The JSMC08AUM1ASAEA-H5 combines a standardized eMMC 5.1 interface with NAND MLC flash capacity and documented HS400 timing to provide a straightforward embedded storage option for commercial designs. Its on-device partition management, secure delete modes, FFU support and system-oriented features such as HPI and device health reporting make it suitable for designs that need integrated boot capability and controlled storage management.

Packaged in a 153-BGA surface-mount footprint and operating from a 3.3 V supply across a −25 °C to 85 °C range, this part is positioned for compact, board-level integration where verifiable eMMC 5.1 behavior and developer-focused datasheet guidance are required.

Request a quote or submit an inquiry to receive pricing, availability and the full technical documentation for the JSMC08AUM1ASAEA-H5.

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    Date Founded: 2000


    Headquarters: Jeju-si, Jeju-do, Republic of Korea


    Employees: 100+


    Revenue: $100 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH


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