JSMC04AUM1ASAED-H5
| Part Description |
4GB eMMC 5.1 1-stack |
|---|---|
| Quantity | 1,763 Available (as of June 17, 2026) |
| Product Category | eMMC Memory |
|---|---|
| Manufacturer | Jeju Semiconductor Corporation |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 153-BGA (8.0x10mm) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 3.3V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C - 85°C | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | N/A | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of JSMC04AUM1ASAED-H5 – 4GB eMMC 5.1 1-stack
The JSMC04AUM1ASAED-H5 is a 32 Gbit (4GB) embedded MultiMediaCard (eMMC) storage device from Jeju Semiconductor. It implements NAND (MLC) flash in an eMMC 5.1 interface and is offered as a surface-mount 153-FBGA package (supplier package: 153-BGA, 8.0 × 10.0 mm).
Designed for embedded solid-state storage, this commercial-grade eMMC supports features documented for the series such as HS400 signaling, partition management and secure operation. Key value comes from its standard eMMC 5.1 interface, compact package, and support for common storage management and security functions published in the product series datasheet.
Key Features
- Memory Core 32 Gbit (4GB) non-volatile NAND flash (MLC) providing embedded solid-state storage capacity.
- Standard Interface eMMC 5.1 interface for host integration; the series datasheet includes HS400 interface support for high-speed modes.
- Clocking 200 MHz clock frequency specified for device operation.
- Power 3.3 V supply voltage as specified for device operation.
- Package & Mounting Surface-mount 153-FBGA package (supplier device package: 153-BGA, 8.0 × 10.0 mm) for compact board-level integration.
- Temperature & Grade Commercial grade operation with an operating temperature range of -25 °C to 85 °C.
- Storage Management & Security Series technical documentation includes partition management (boot area and RPMB), secure delete support (sanitize, secure erase, secure trim), packed commands, and device health reporting.
- Field & Performance Features Series-level features documented include Field Firmware Upgrade (FFU), cache management, high-priority interrupt (HPI), auto power saving modes, and extended CSD register support for device configuration and performance tuning.
- Compliance RoHS compliant.
Typical Applications
- Embedded storage systems Use as onboard non-volatile flash storage where eMMC 5.1 compatibility is required.
- Compact electronic modules Low-profile 153-FBGA package fits space-constrained board designs that require surface-mount flash memory.
- Commercial-grade equipment Suitable for systems that operate within the -25 °C to 85 °C range and require standard eMMC storage management features.
Unique Advantages
- Standardized eMMC 5.1 interface Simplifies host integration with a widely adopted storage interface and documented HS400 support for high-speed modes.
- Embedded NAND MLC capacity 32 Gbit (4GB) MLC NAND provides a balance of density and endurance characteristics suitable for many embedded applications.
- Compact, surface-mount package 153-FBGA (153-BGA, 8.0 × 10.0 mm) enables compact board layouts and straightforward assembly.
- Operational robustness Commercial-grade temperature range and RoHS compliance help meet regulatory and thermal requirements for mainstream embedded products.
- Series-level management and security features Partition management, secure delete options, device health reporting, and field firmware upgrade capabilities support maintainability and secure operation.
Why Choose JSMC04AUM1ASAED-H5?
The JSMC04AUM1ASAED-H5 delivers a standardized eMMC 5.1 solution in a small-footprint FBGA package, combining 32 Gbit MLC NAND storage with a documented feature set for partitioning, security, power saving, and field firmware updates. Its 3.3 V supply, 200 MHz clock specification, and commercial temperature rating make it suitable for embedded designs that require reliable, removable-host-compatible storage.
This part is appropriate for design teams seeking an eMMC device with series-documented HS400 support and storage management features. It provides clear specification points for integration, enabling predictable board-level design and firmware planning while benefiting from Jeju Semiconductor’s documented device registers and extended CSD capabilities.
Request a quote or submit an inquiry to obtain pricing, availability, and technical support details for JSMC04AUM1ASAED-H5.

Date Founded: 2000
Headquarters: Jeju-si, Jeju-do, Republic of Korea
Employees: 100+
Revenue: $100 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, AEC-Q100, RoHS, REACH