EN25QA32B-104BBIP(2B)
| Part Description |
32 Mbit SPI NOR Flash (Industrial, 24-ball TFBGA) |
|---|---|
| Quantity | 517 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 24-ball TFBGA 6x8mm | Memory Format | NOR Flash | Technology | SPI NOR Flash | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Mbit | Access Time | 8 ns | Grade | Industrial | ||
| Clock Frequency | 104 MHz | Voltage | 2.5V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 3 ms | Packaging | 24-ball TFBGA 6x8mm | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 4M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of EN25QA32B-104BBIP(2B) – 32 Mbit SPI NOR Flash (Industrial, 24-ball TFBGA)
The EN25QA32B-104BBIP(2B) is a 32 Mbit serial SPI NOR Flash memory offering high-performance SPI, Dual and Quad I/O modes for fast read throughput. Designed with a uniform-sector architecture and enhanced protection features, it targets industrial-grade embedded storage needs where reliable non-volatile code and data retention are required.
Built for systems requiring up to 104 MHz SPI clock operation and support for Dual/Quad transfer modes, this device delivers compact 4M × 8 organization in a 24-ball TFBGA (6 × 8 mm) package and operates across an industrial temperature range of −40°C to 85°C.
Key Features
- Memory Core 32 M-bit capacity organized as 4M × 8 with 4,096 K-byte total, 16,384 pages and 256-byte programmable pages for flexible code and data storage.
- Serial SPI Interface Supports Standard, Dual and Quad SPI modes (Standard: CLK, CS#, DI, DO; Dual: CLK, CS#, DQ0, DQ1; Quad: CLK, CS#, DQ0–DQ3) with SPI clock up to 104 MHz.
- High Read/Throughput Performance 104 MHz clock rate in Standard, Dual and Quad modes; Dual I/O provides equivalent 208 MHz and Quad I/O equivalent 416 MHz effective data rates when using fast read instructions.
- Program and Erase Performance Typical page program time 0.6 ms; sector erase ~50 ms typical; 32 KB block erase ~120 ms; 64 KB block erase ~150 ms; chip erase ~15 seconds typical.
- Low Power Typical active current ~5 mA and power-down current ~1 μA for energy-efficient operation in power-sensitive systems.
- Uniform Sector Architecture & Reliability 1024 sectors of 4 KB, 128 blocks of 32 KB and 64 blocks of 64 KB; minimum 100K program/erase cycles per sector and 20 years data retention.
- Security & Discoverability Three lockable 512-byte OTP security sectors, Read Unique ID feature and Serial Flash Discoverable Parameters (SFDP) support for system identification and protection.
- Package & Environmental Surface-mount 24-ball TFBGA (6 × 8 mm) package; industrial operating temperature −40°C to 85°C; RoHS compliant.
Typical Applications
- Industrial Control Stores firmware, configuration and calibration data in factory automation and control equipment, leveraging the industrial temperature range and sector-level erase flexibility.
- Embedded Systems Provides non-volatile program and data storage for microcontroller-based systems that require reliable SPI Flash with Dual/Quad throughput options.
- Communications & Networking Equipment Holds boot code, configuration tables and small file systems where fast SPI read performance and low power draw are required.
Unique Advantages
- Flexible SPI Modes Standard, Dual and Quad I/O support lets designers trade off pin count and throughput to meet system bandwidth requirements.
- Uniform Sectors for Granular Erase 4 KB sector granularity enables targeted updates and reduces erase overhead when modifying small firmware regions.
- Fast Program and Erase Typical page program and sector/block erase timings accelerate development cycles and in-field updates.
- Industrial Reliability Rated for −40°C to 85°C operation with 100K program/erase cycle endurance and 20-year data retention for long-term deployments.
- Security and Identification Lockable OTP sectors and unique ID support improve device-level protection and traceability for secure systems.
- Compact, Surface-Mount Package 24-ball TFBGA (6 × 8 mm) package minimizes board space while supporting robust surface-mount assembly.
Why Choose EN25QA32B-104BBIP(2B)?
The EN25QA32B-104BBIP(2B) combines a proven SPI NOR architecture with Dual/Quad I/O flexibility, sector-level erase control and industrial-grade operating range—making it well suited for embedded and industrial applications that require reliable non-volatile storage. Its documented program/erase performance, low-power standby behavior and security options provide practical benefits across firmware storage, configuration retention and system updates.
This device is an appropriate choice for engineers designing systems that need compact flash capacity, predictable erase/program characteristics and support for high-throughput SPI modes while operating over an extended temperature range.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for the EN25QA32B-104BBIP(2B).
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A