EN25QA64A-104BBIP

The EN25QA64A-104BBIP is a 64 Megabit serial NOR Flash memory device in a 24‑ball TFBGA (6×8 mm) surface‑mount package. It implements SPI serial Flash architecture with support for Standard, Dual and Quad SPI modes and high‑speed read performance up to 104 MHz.

Designed for industrial‑grade applications, this non‑volatile memory delivers flexible memory organization, sector/block erase granularity and hardware/software protection features that suit embedded firmware storage, code shadowing and data logging in temperature‑sensitive environments.

Key Features

• Memory Capacity & Organization — 64 Mbit (8,192 KByte) organized as 8M × 8 with 32,768 pages and 256‑byte programmable page size; uniform 4‑Kbyte sectors and multiple block sizes provide flexible erase granularity.
• Serial SPI Interface — SPI compatible with Mode 0 and Mode 3; supports Standard, Dual and Quad SPI (CLK, CS#, DI/DO, DQ0–DQ3) for higher throughput and flexible pin usage.
• High‑Speed Read — Normal read up to 83 MHz; fast read modes support 104 MHz in Standard and Dual SPI (1 dummy byte) and Quad SPI (104 MHz with 3 dummy bytes) for accelerated execute‑in‑place and code fetch scenarios.
• Program / Erase Performance — Typical page program time 0.5 ms; typical sector erase 40 ms, half‑block erase 200 ms, block erase 300 ms and chip erase ~32 seconds for efficient field updates and maintenance.
• Low Power — Typical active current around 5 mA and typical power‑down current approximately 1 μA to minimize system power during idle periods.
• Security & Protection — Software and permanent protection mechanisms, configurable write‑protect features and a lockable 512‑byte OTP security sector; supports Read Unique ID and volatile status register bits.
• Reliability — Minimum 100K program/erase cycles per sector and typical data retention of 20 years to support long life industrial deployments.
• Package & Temperature — 24‑ball TFBGA (6×8 mm), surface mount; industrial operating temperature range −40°C to 85°C; RoHS compliant.

Typical Applications

• Embedded firmware storage — Store boot code, firmware images and application code with fast execute‑in‑place capability using Standard/Dual/Quad SPI modes.
• Industrial control systems — Retain configuration, calibration and control code across power cycles in devices operating across −40°C to 85°C.
• Communications and networking equipment — Provide non‑volatile storage for bootloader and configuration files where high read throughput is required.
• Consumer and IoT devices — Manage firmware updates and secure data segments with lockable OTP and software protection features.

Unique Advantages

• Flexible SPI modes: Support for Standard, Dual and Quad SPI enables designers to trade pins for throughput and optimize system interfaces.
• High read throughput: Fast read operation at 104 MHz reduces code fetch latency and improves boot and runtime performance in memory‑mapped or XIP use cases.
• Fine erase granularity: Uniform 4‑Kbyte sectors plus 32K/64K block options permit targeted updates and reduce erase‑write overhead.
• Field update readiness: Fast page program (0.5 ms typical) and defined erase timings simplify firmware update strategies and reduce maintenance windows.
• Industrial reliability: 100K program/erase cycles and 20‑year data retention provide sustained endurance and long‑term data integrity for deployed systems.
• Compact, surface‑mount package: 24‑ball TFBGA (6×8 mm) offers a small footprint for space‑constrained PCBs while supporting industrial temperature operation.

Why Choose EN25QA64A-104BBIP?

The EN25QA64A-104BBIP delivers a balanced combination of high‑speed SPI performance, flexible memory organization and industrial‑grade reliability. Its quad/dual/standard SPI support and 104 MHz fast read capability make it suitable for designs that require rapid code access or large firmware images, while sector‑level erase and robust protection features enable safe field updates and secure storage segments.

This part is well suited to embedded and industrial applications where endurance, long data retention and compact surface‑mount packaging are priorities. The device’s defined program/erase timings, low power modes and protection mechanisms help reduce system complexity and support predictable maintenance and lifecycle planning.

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