FEMC512GBA-E530

AXO 5.1 100ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC512GBA-E530 512GB eMMC 5.1 3D TLC

Quantity 1,151 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size4.096 TbitGradeAutomotive grade 3Clock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging100-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization512G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 3ECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC512GBA-E530 – 512GB eMMC 5.1 Automotive-Grade Embedded Flash Storage

The FEMC512GBA-E530 from Flexxon's AXO Series is a high-capacity 512GB embedded MultiMediaCard (eMMC 5.1) storage solution built with advanced 3D TLC NAND flash technology. Designed to meet the stringent requirements of automotive and industrial applications, this surface-mount memory module integrates flash controller and non-volatile memory in a compact 100-ball FBGA package. With AEC-Q100 Grade 3 qualification and an extended operating temperature range of -25°C to 85°C, the FEMC512GBA-E530 delivers reliable, high-performance storage for systems demanding robust data retention and longevity.

Operating at 200 MHz clock frequency and supporting both 1.8V and 3.3V I/O voltage levels, this eMMC 5.1 device provides the performance, capacity, and environmental resilience needed for automotive infotainment systems, industrial controllers, embedded computing platforms, and other mission-critical applications where data integrity and temperature tolerance are paramount.

Key Features

  • High-Capacity Storage
    512GB (4.096 Tbit) total memory capacity organized as 512G × 8, providing ample space for operating systems, applications, multimedia content, and data logging in embedded systems.
  • eMMC 5.1 Interface
    Industry-standard JEDEC eMMC 5.1 interface operating at 200 MHz clock frequency ensures broad compatibility with modern embedded processors and system-on-chip (SoC) platforms while delivering consistent performance.
  • 3D TLC NAND Technology
    Built using advanced 3D Triple-Level Cell (TLC) NAND flash memory technology, balancing high storage density with cost efficiency while maintaining reliable data retention and endurance for embedded applications.
  • Automotive-Grade Qualification
    AEC-Q100 Grade 3 qualified for automotive applications, meeting rigorous automotive industry reliability and quality standards with an operating temperature range of -25°C to 85°C suitable for in-cabin and controlled environment deployments.
  • Flexible Voltage Support
    Supports dual voltage operation with VCCQ at 1.8V/3.3V and VCC at 3.3V, enabling compatibility with diverse system architectures and power management requirements.
  • Compact Surface-Mount Package
    100-ball FBGA (Fine-pitch Ball Grid Array) package delivers a small footprint for space-constrained designs while providing robust electrical connections for high-reliability applications.
  • RoHS Compliant
    Fully compliant with RoHS environmental directives, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

  • Automotive Infotainment Systems
    Provides high-capacity storage for navigation data, multimedia content, user interfaces, and software updates in automotive dashboard and entertainment systems operating within controlled temperature environments.
  • Industrial Control and Automation
    Serves as reliable embedded storage for industrial controllers, HMIs (Human-Machine Interfaces), and programmable logic controllers requiring robust data retention across extended temperature ranges.
  • Embedded Computing Platforms
    Supports operating systems, application software, and data storage needs in single-board computers, edge computing devices, and embedded systems where compact form factor and reliability are essential.
  • Data Logging and Telemetry
    Enables high-volume data capture and storage in monitoring systems, telemetry equipment, and IoT gateways that require substantial non-volatile memory capacity with automotive-grade reliability.
  • Medical and Test Equipment
    Provides dependable storage for firmware, configuration data, and recorded measurements in portable medical devices and test instrumentation operating in controlled environments.

Unique Advantages

  • Automotive-Qualified Reliability:
    AEC-Q100 Grade 3 certification ensures the FEMC512GBA-E530 meets automotive industry quality and reliability standards, reducing risk in demanding applications and supporting long product lifecycles.
  • Exceptional Storage Capacity:
    512GB capacity addresses the growing storage demands of modern embedded systems, eliminating the need for external storage solutions and simplifying system architecture.
  • Integrated Controller Architecture:
    Embedded flash controller handles wear leveling, bad block management, and error correction internally, reducing host processor overhead and simplifying firmware development.
  • Wide Voltage Compatibility:
    Dual voltage I/O support (1.8V/3.3V) provides design flexibility, enabling integration with both legacy and modern embedded platforms without requiring additional voltage translation circuitry.
  • Extended Temperature Performance:
    -25°C to 85°C operating range ensures reliable operation in automotive cabins, industrial environments, and outdoor enclosures where ambient temperatures fluctuate beyond commercial grade specifications.
  • Standards-Based Integration:
    JEDEC eMMC 5.1 compliance ensures seamless integration with existing hardware designs and software stacks, accelerating time-to-market and reducing development risk.

Why Choose the FEMC512GBA-E530?

The FEMC512GBA-E530 represents an ideal balance of capacity, reliability, and automotive-grade qualification for demanding embedded storage applications. With 512GB of 3D TLC flash memory, AEC-Q100 Grade 3 certification, and extended temperature operation, this eMMC 5.1 solution addresses the critical requirements of automotive infotainment, industrial control, and rugged embedded computing platforms. The compact 100-ball FBGA package minimizes board space while the integrated controller architecture simplifies system design and reduces development complexity.

Engineers and product developers working on automotive-qualified systems, industrial equipment, or embedded platforms requiring high-capacity, temperature-resilient storage will find the FEMC512GBA-E530 delivers proven technology from Flexxon's AXO Series. The combination of standards-based eMMC 5.1 interface, flexible voltage support, and automotive qualification makes this module particularly well-suited for designs where long-term availability, regulatory compliance, and field reliability are non-negotiable requirements.

Ready to integrate the FEMC512GBA-E530 into your next design? Request a quote today to discuss volume pricing, delivery schedules, and technical support for your specific application requirements. Our team is available to assist with integration guidance and answer your technical questions.

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